JPS6250080B2 - - Google Patents
Info
- Publication number
- JPS6250080B2 JPS6250080B2 JP16876380A JP16876380A JPS6250080B2 JP S6250080 B2 JPS6250080 B2 JP S6250080B2 JP 16876380 A JP16876380 A JP 16876380A JP 16876380 A JP16876380 A JP 16876380A JP S6250080 B2 JPS6250080 B2 JP S6250080B2
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- lead
- terminal
- leads
- circuit component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000002184 metal Substances 0.000 claims description 71
- 229910052751 metal Inorganic materials 0.000 claims description 71
- 238000000034 method Methods 0.000 claims description 31
- 238000005476 soldering Methods 0.000 claims description 27
- 230000008569 process Effects 0.000 claims description 15
- 238000004519 manufacturing process Methods 0.000 claims description 13
- 238000005553 drilling Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 17
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16876380A JPS5792898A (en) | 1980-11-29 | 1980-11-29 | Electric circuit wiring unit and method of producing same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16876380A JPS5792898A (en) | 1980-11-29 | 1980-11-29 | Electric circuit wiring unit and method of producing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5792898A JPS5792898A (en) | 1982-06-09 |
| JPS6250080B2 true JPS6250080B2 (enrdf_load_stackoverflow) | 1987-10-22 |
Family
ID=15873984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16876380A Granted JPS5792898A (en) | 1980-11-29 | 1980-11-29 | Electric circuit wiring unit and method of producing same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5792898A (enrdf_load_stackoverflow) |
-
1980
- 1980-11-29 JP JP16876380A patent/JPS5792898A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5792898A (en) | 1982-06-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH04147579A (ja) | スルーホール接続形電子デバイスとその実装方法 | |
| US6151221A (en) | Printed circuit board having wire clamps for securing component leads | |
| US4506443A (en) | Method of mounting electric part onto a substrate | |
| JP2001156488A (ja) | シールドケース付き電子部品及びその製造方法 | |
| JPS6250080B2 (enrdf_load_stackoverflow) | ||
| JPH0685425A (ja) | 電子部品搭載用基板 | |
| JPS5835379B2 (ja) | 回路部品の配線方法 | |
| JP2573623B2 (ja) | 高周波機器の製造方法 | |
| EP0305166A1 (en) | Electrical connection pin | |
| JPH05129753A (ja) | デイスクリート部品およびデイスクリート部品のプリント基板実装方法 | |
| JPS5926619Y2 (ja) | 電子部品の接続構造 | |
| JPH0319241Y2 (enrdf_load_stackoverflow) | ||
| JP2637369B2 (ja) | 電子部品のテーピング方法 | |
| JPH06349561A (ja) | リード端子の配線基板への半田付け方法 | |
| JP2600774B2 (ja) | 角形電子部品の製造方法 | |
| JPS6223478B2 (enrdf_load_stackoverflow) | ||
| JPS6219573Y2 (enrdf_load_stackoverflow) | ||
| JPS5923437Y2 (ja) | 印刷配線板に於ける電気部品取付け装置 | |
| JPH02148710A (ja) | リード端子付回路部品の挿入組付け方法 | |
| JPS59207690A (ja) | 集積回路素子の実装方法 | |
| JPS6316892B2 (enrdf_load_stackoverflow) | ||
| JPS6333317B2 (enrdf_load_stackoverflow) | ||
| JPH04199758A (ja) | 回路基板 | |
| JPH0548239A (ja) | 回路基板の形成方法 | |
| JPS59106188A (ja) | プリント基板 |