JPS6249640A - 金電極構造およびその製造方法 - Google Patents

金電極構造およびその製造方法

Info

Publication number
JPS6249640A
JPS6249640A JP60192218A JP19221885A JPS6249640A JP S6249640 A JPS6249640 A JP S6249640A JP 60192218 A JP60192218 A JP 60192218A JP 19221885 A JP19221885 A JP 19221885A JP S6249640 A JPS6249640 A JP S6249640A
Authority
JP
Japan
Prior art keywords
gold
gold electrode
wire
surface roughness
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60192218A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0525176B2 (enExample
Inventor
Yukio Murata
村田　幸男
Toshiaki Shoji
俊明 庄司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP60192218A priority Critical patent/JPS6249640A/ja
Publication of JPS6249640A publication Critical patent/JPS6249640A/ja
Publication of JPH0525176B2 publication Critical patent/JPH0525176B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Electronic Switches (AREA)
  • Details Of Resistors (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP60192218A 1985-08-29 1985-08-29 金電極構造およびその製造方法 Granted JPS6249640A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60192218A JPS6249640A (ja) 1985-08-29 1985-08-29 金電極構造およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60192218A JPS6249640A (ja) 1985-08-29 1985-08-29 金電極構造およびその製造方法

Publications (2)

Publication Number Publication Date
JPS6249640A true JPS6249640A (ja) 1987-03-04
JPH0525176B2 JPH0525176B2 (enExample) 1993-04-12

Family

ID=16287625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60192218A Granted JPS6249640A (ja) 1985-08-29 1985-08-29 金電極構造およびその製造方法

Country Status (1)

Country Link
JP (1) JPS6249640A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006049095A1 (ja) * 2004-11-04 2006-05-11 Rohm Co., Ltd. サーマルプリントヘッドおよびその製造方法
US7697020B2 (en) 2004-11-04 2010-04-13 Rohm Co., Ltd. Thermal print head and method for manufacturing same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS547866A (en) * 1977-06-20 1979-01-20 Mitsubishi Electric Corp Manufacture for semiconductor device
JPS5434678A (en) * 1977-08-22 1979-03-14 Matsushita Electronics Corp Semiconductor device
JPS5739548A (en) * 1980-08-21 1982-03-04 Toshiba Corp Semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS547866A (en) * 1977-06-20 1979-01-20 Mitsubishi Electric Corp Manufacture for semiconductor device
JPS5434678A (en) * 1977-08-22 1979-03-14 Matsushita Electronics Corp Semiconductor device
JPS5739548A (en) * 1980-08-21 1982-03-04 Toshiba Corp Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006049095A1 (ja) * 2004-11-04 2006-05-11 Rohm Co., Ltd. サーマルプリントヘッドおよびその製造方法
JP2006130707A (ja) * 2004-11-04 2006-05-25 Rohm Co Ltd サーマルヘッドおよびその製造方法
US7697020B2 (en) 2004-11-04 2010-04-13 Rohm Co., Ltd. Thermal print head and method for manufacturing same

Also Published As

Publication number Publication date
JPH0525176B2 (enExample) 1993-04-12

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term