JPS6248968B2 - - Google Patents
Info
- Publication number
- JPS6248968B2 JPS6248968B2 JP58073195A JP7319583A JPS6248968B2 JP S6248968 B2 JPS6248968 B2 JP S6248968B2 JP 58073195 A JP58073195 A JP 58073195A JP 7319583 A JP7319583 A JP 7319583A JP S6248968 B2 JPS6248968 B2 JP S6248968B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- parts
- weight
- formula
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7319583A JPS59197421A (ja) | 1983-04-26 | 1983-04-26 | 硬化性エポキシ樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7319583A JPS59197421A (ja) | 1983-04-26 | 1983-04-26 | 硬化性エポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59197421A JPS59197421A (ja) | 1984-11-09 |
| JPS6248968B2 true JPS6248968B2 (cg-RX-API-DMAC7.html) | 1987-10-16 |
Family
ID=13511113
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7319583A Granted JPS59197421A (ja) | 1983-04-26 | 1983-04-26 | 硬化性エポキシ樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59197421A (cg-RX-API-DMAC7.html) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63110212A (ja) * | 1986-10-27 | 1988-05-14 | Toshiba Chem Corp | 封止用樹脂組成物 |
| US5220047A (en) * | 1990-09-17 | 1993-06-15 | Union Carbide Chemicals & Plastics Technology Corporation | Carbamate silicon compounds as latent coupling agents and process for preparation and use |
| JP4672135B2 (ja) * | 2000-12-15 | 2011-04-20 | 旭化成イーマテリアルズ株式会社 | アルコキシシラン化合物及び感光性樹脂組成物 |
| DE102005026085A1 (de) | 2005-06-07 | 2006-12-14 | Construction Research & Technology Gmbh | Silan-modifizierte Harnstoff-Derivate, Verfahren zu ihrer Herstellung und deren Verwendung als Rheologiehilfsmittel |
| JP5565220B2 (ja) * | 2010-09-03 | 2014-08-06 | 横浜ゴム株式会社 | 湿気硬化型樹脂組成物 |
| JP6664398B2 (ja) * | 2014-12-09 | 2020-03-13 | コリア インスティチュート オブ インダストリアル テクノロジー | 2つ以上のアルコキシシリル基を有する熱硬化性アルコキシシリル化合物、それを含む組成物、硬化物、及びその用途、並びにアルコキシシリル化合物の製造方法 |
| US12031013B2 (en) * | 2021-07-19 | 2024-07-09 | Momentive Performance Materials Inc. | Silane coupling agents to improve resin adhesion |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55153357A (en) * | 1979-05-18 | 1980-11-29 | Hitachi Ltd | Manufacturing method of resin sealed semiconductor device |
| JPS5657792A (en) * | 1979-10-15 | 1981-05-20 | Shin Etsu Chem Co Ltd | Preparation of ureido group-containing alkoxysilane |
| JPS5679150A (en) * | 1979-11-30 | 1981-06-29 | Daikin Ind Ltd | Epoxy composition containing fluorine |
| JPS56122145A (en) * | 1980-02-29 | 1981-09-25 | Shin Etsu Chem Co Ltd | Resin composition for sealing semiconductor device |
| JPS56136816A (en) * | 1980-03-31 | 1981-10-26 | Shin Etsu Chem Co Ltd | Epoxy resin composition |
-
1983
- 1983-04-26 JP JP7319583A patent/JPS59197421A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59197421A (ja) | 1984-11-09 |