JPS6248894B2 - - Google Patents

Info

Publication number
JPS6248894B2
JPS6248894B2 JP56022916A JP2291681A JPS6248894B2 JP S6248894 B2 JPS6248894 B2 JP S6248894B2 JP 56022916 A JP56022916 A JP 56022916A JP 2291681 A JP2291681 A JP 2291681A JP S6248894 B2 JPS6248894 B2 JP S6248894B2
Authority
JP
Japan
Prior art keywords
lead
image
pellet
circular mark
optical system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56022916A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57138148A (en
Inventor
Makoto Ariga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56022916A priority Critical patent/JPS57138148A/ja
Publication of JPS57138148A publication Critical patent/JPS57138148A/ja
Publication of JPS6248894B2 publication Critical patent/JPS6248894B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/8513—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP56022916A 1981-02-20 1981-02-20 Wire bonding method for integrated circuit Granted JPS57138148A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56022916A JPS57138148A (en) 1981-02-20 1981-02-20 Wire bonding method for integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56022916A JPS57138148A (en) 1981-02-20 1981-02-20 Wire bonding method for integrated circuit

Publications (2)

Publication Number Publication Date
JPS57138148A JPS57138148A (en) 1982-08-26
JPS6248894B2 true JPS6248894B2 (enrdf_load_stackoverflow) 1987-10-16

Family

ID=12095960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56022916A Granted JPS57138148A (en) 1981-02-20 1981-02-20 Wire bonding method for integrated circuit

Country Status (1)

Country Link
JP (1) JPS57138148A (enrdf_load_stackoverflow)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52140278A (en) * 1976-05-19 1977-11-22 Hitachi Ltd Position detector

Also Published As

Publication number Publication date
JPS57138148A (en) 1982-08-26

Similar Documents

Publication Publication Date Title
US5642158A (en) Method and apparatus to detect capillary indentations
JPH04225537A (ja) チップ位置検出方法
JPS6248894B2 (enrdf_load_stackoverflow)
JPH11307567A (ja) バンプ検査工程を有する半導体装置の製造方法
JPH0335108A (ja) リード位置認識装置
JP2999298B2 (ja) 画像認識手段による電子部品の位置検出装置
US6510240B1 (en) Automatic detection of die absence on the wire bonding machine
JPH05347326A (ja) ワイヤボンディング装置におけるキャピラリのセッティング方法
JPH05225315A (ja) 被加工体の外形認識装置
JPS6215909B2 (enrdf_load_stackoverflow)
JPH06105212B2 (ja) ヘツドライトの主光軸検査方法
JPH0512421A (ja) 画像認識手段による電子部品の位置検出装置
JPS6146053B2 (enrdf_load_stackoverflow)
JPS60123976A (ja) パタ−ン認識方法および装置
JPH0249484B2 (enrdf_load_stackoverflow)
JP2002299369A (ja) ボンディング装置
JP3169046B2 (ja) チップの認識方法及びその認識装置
JPH0210102A (ja) 基板の位置決めマーク検出方法
JPH0133939B2 (enrdf_load_stackoverflow)
JP3006437B2 (ja) 電子部品観察装置及び電子部品観察方法
JPH0982739A (ja) ボンディングワイヤ検査装置
JPS6251233A (ja) 半導体素子表面不良マ−ク認識装置
JPS58147038A (ja) ボンデイングパツドの自動位置認識方法
JP3708409B2 (ja) 球状突起の配列検査装置および配列検査方法
JPS6137377A (ja) 自動溶接機の溶接線始終端検出装置および検出方法