JPS57138148A - Wire bonding method for integrated circuit - Google Patents

Wire bonding method for integrated circuit

Info

Publication number
JPS57138148A
JPS57138148A JP56022916A JP2291681A JPS57138148A JP S57138148 A JPS57138148 A JP S57138148A JP 56022916 A JP56022916 A JP 56022916A JP 2291681 A JP2291681 A JP 2291681A JP S57138148 A JPS57138148 A JP S57138148A
Authority
JP
Japan
Prior art keywords
focus
marks
pellet
optical system
signals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56022916A
Other languages
Japanese (ja)
Other versions
JPS6248894B2 (en
Inventor
Makoto Ariga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56022916A priority Critical patent/JPS57138148A/en
Publication of JPS57138148A publication Critical patent/JPS57138148A/en
Publication of JPS6248894B2 publication Critical patent/JPS6248894B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
    • H01L2224/8513—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors using marks formed on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To eliminate the need for adjusting a focus in an automatic device by adjusting the focus to either or the middle of a pellet having difference in stages and a lead in the same optical system, imaging both positioning marks, changing an indistinct image into binary system and detecting the position. CONSTITUTION:A camera such as a TV camera 1 with the optical system 2 is driven in the X and Y directions, and matching marks formed to the leads 7 of a package 3 and the pellet 6 are imaged. The signals are picture-processed, the positions of the marks are detected, a stage 5 is driven by a controller 10, and automatic bonding is conducted. The picture processor 4 is given a function which changes the signals into binary system and processes them, and the position of the focus at the time of imaging is used as the position of the focus of parts such as the leads 7. In this case, an obscure image is obtained due to difference in stages at the pellet side, but the locations of the marks can be detected at accuracy within the allowable range of bonding by setting the image at a proper level and changing the picture signals into binary. Accordingly, automatic bonding is enabled without forming a focus adjusting function to the the optical system because the information of a reference position is acquired.
JP56022916A 1981-02-20 1981-02-20 Wire bonding method for integrated circuit Granted JPS57138148A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56022916A JPS57138148A (en) 1981-02-20 1981-02-20 Wire bonding method for integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56022916A JPS57138148A (en) 1981-02-20 1981-02-20 Wire bonding method for integrated circuit

Publications (2)

Publication Number Publication Date
JPS57138148A true JPS57138148A (en) 1982-08-26
JPS6248894B2 JPS6248894B2 (en) 1987-10-16

Family

ID=12095960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56022916A Granted JPS57138148A (en) 1981-02-20 1981-02-20 Wire bonding method for integrated circuit

Country Status (1)

Country Link
JP (1) JPS57138148A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52140278A (en) * 1976-05-19 1977-11-22 Hitachi Ltd Position detector

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52140278A (en) * 1976-05-19 1977-11-22 Hitachi Ltd Position detector

Also Published As

Publication number Publication date
JPS6248894B2 (en) 1987-10-16

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