SE9403479D0 - Close imaging of components - Google Patents

Close imaging of components

Info

Publication number
SE9403479D0
SE9403479D0 SE9403479A SE9403479A SE9403479D0 SE 9403479 D0 SE9403479 D0 SE 9403479D0 SE 9403479 A SE9403479 A SE 9403479A SE 9403479 A SE9403479 A SE 9403479A SE 9403479 D0 SE9403479 D0 SE 9403479D0
Authority
SE
Sweden
Prior art keywords
components
image
captured
pipettes
component
Prior art date
Application number
SE9403479A
Other languages
Swedish (sv)
Other versions
SE9403479L (en
SE515418C2 (en
Inventor
Nils Jacobsson
Original Assignee
Mydata Automation Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mydata Automation Ab filed Critical Mydata Automation Ab
Priority to SE9403479A priority Critical patent/SE515418C2/en
Publication of SE9403479D0 publication Critical patent/SE9403479D0/en
Priority to PCT/SE1995/001176 priority patent/WO1996012395A1/en
Priority to JP8513152A priority patent/JPH10507584A/en
Priority to EP95934941A priority patent/EP0786198A1/en
Publication of SE9403479L publication Critical patent/SE9403479L/en
Publication of SE515418C2 publication Critical patent/SE515418C2/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/041—Incorporating a pick-up tool having multiple pick-up tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Image Input (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)

Abstract

A pickup head (2) for an automatic component assembly machine comprises several pipettes (1) placed next to each other for retaining components (3) at the sucking nozzles of the pipettes. An image of the component is captured by means of a video camera (7) and a lens system (5) to be used in an automatic evaluation (7') of the positions of the components on the pipettes (1). This image is composed by superposing successive images, which are captured of only one component (3) at a time. With a suitable movement of the pickup head (2) between the capturing of the successive images the reproductions of the individual components can be packed closely in the composed image. This results in that the lens system (5) can be adjusted for a larger magnification than if only one image had been captured of all the components (3) at the same time. Thereby a more accurate determination of the positions of the components can be achieved in the evaluation.
SE9403479A 1994-10-12 1994-10-12 Method and apparatus for imaging in a variety of retained components for automatic evaluation of component positions and use of such apparatus SE515418C2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SE9403479A SE515418C2 (en) 1994-10-12 1994-10-12 Method and apparatus for imaging in a variety of retained components for automatic evaluation of component positions and use of such apparatus
PCT/SE1995/001176 WO1996012395A1 (en) 1994-10-12 1995-10-12 Compact reproduction of components
JP8513152A JPH10507584A (en) 1994-10-12 1995-10-12 Compact copy of parts
EP95934941A EP0786198A1 (en) 1994-10-12 1995-10-12 Compact reproduction of components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE9403479A SE515418C2 (en) 1994-10-12 1994-10-12 Method and apparatus for imaging in a variety of retained components for automatic evaluation of component positions and use of such apparatus

Publications (3)

Publication Number Publication Date
SE9403479D0 true SE9403479D0 (en) 1994-10-12
SE9403479L SE9403479L (en) 1996-04-13
SE515418C2 SE515418C2 (en) 2001-07-30

Family

ID=20395589

Family Applications (1)

Application Number Title Priority Date Filing Date
SE9403479A SE515418C2 (en) 1994-10-12 1994-10-12 Method and apparatus for imaging in a variety of retained components for automatic evaluation of component positions and use of such apparatus

Country Status (4)

Country Link
EP (1) EP0786198A1 (en)
JP (1) JPH10507584A (en)
SE (1) SE515418C2 (en)
WO (1) WO1996012395A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19934619A1 (en) * 1999-07-23 2001-01-25 Merten Kg Pulsotronic Component inspection device has optical deflection device that feeds image produced from direction different from first image to video camera
WO2002085091A2 (en) 2000-12-15 2002-10-24 Cyberoptics Corporation Camera with improved illuminator
WO2002049410A2 (en) 2000-12-15 2002-06-20 Cyberoptics Corporation Board align image acquisition device with improved interface

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4810154A (en) * 1988-02-23 1989-03-07 Molex Incorporated Component feeder apparatus and method for vision-controlled robotic placement system
JPH02165699A (en) * 1988-12-20 1990-06-26 Matsushita Electric Ind Co Ltd Mounting method of flat package type ic using industrial robot
JPH0494600A (en) * 1990-08-11 1992-03-26 Tdk Corp Method and apparatus for mounting electronic component
JP2851023B2 (en) * 1992-06-29 1999-01-27 株式会社鷹山 IC tilt inspection method
JP2554431B2 (en) * 1992-11-05 1996-11-13 ヤマハ発動機株式会社 Mounting device component suction state detection device

Also Published As

Publication number Publication date
WO1996012395A1 (en) 1996-04-25
SE9403479L (en) 1996-04-13
SE515418C2 (en) 2001-07-30
JPH10507584A (en) 1998-07-21
EP0786198A1 (en) 1997-07-30

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