JPS6246292Y2 - - Google Patents
Info
- Publication number
- JPS6246292Y2 JPS6246292Y2 JP583179U JP583179U JPS6246292Y2 JP S6246292 Y2 JPS6246292 Y2 JP S6246292Y2 JP 583179 U JP583179 U JP 583179U JP 583179 U JP583179 U JP 583179U JP S6246292 Y2 JPS6246292 Y2 JP S6246292Y2
- Authority
- JP
- Japan
- Prior art keywords
- light
- emitting
- light emitting
- display device
- condenser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 4
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 229920006352 transparent thermoplastic Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Illuminated Signs And Luminous Advertising (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP583179U JPS6246292Y2 (enrdf_load_html_response) | 1979-01-19 | 1979-01-19 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP583179U JPS6246292Y2 (enrdf_load_html_response) | 1979-01-19 | 1979-01-19 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55105968U JPS55105968U (enrdf_load_html_response) | 1980-07-24 |
JPS6246292Y2 true JPS6246292Y2 (enrdf_load_html_response) | 1987-12-12 |
Family
ID=28812059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP583179U Expired JPS6246292Y2 (enrdf_load_html_response) | 1979-01-19 | 1979-01-19 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6246292Y2 (enrdf_load_html_response) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0642564B2 (ja) * | 1983-02-15 | 1994-06-01 | 日本デンヨ−株式会社 | Ledランプ |
JP2642618B2 (ja) * | 1986-03-06 | 1997-08-20 | 富士電機株式会社 | 表示灯装置 |
JP2003158302A (ja) * | 2001-11-21 | 2003-05-30 | Toyoda Gosei Co Ltd | 発光ダイオード |
US7781787B2 (en) * | 2001-11-16 | 2010-08-24 | Toyoda Gosei, Co., Ltd. | Light-emitting diode, led light, and light apparatus |
JP4816707B2 (ja) * | 2002-03-20 | 2011-11-16 | 豊田合成株式会社 | 発光器及び自動車のバックライト |
KR100828891B1 (ko) * | 2006-02-23 | 2008-05-09 | 엘지이노텍 주식회사 | Led 패키지 |
JP6693044B2 (ja) * | 2015-03-13 | 2020-05-13 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
JP7007606B2 (ja) * | 2020-04-15 | 2022-01-24 | 日亜化学工業株式会社 | 発光装置およびその製造方法 |
JP7609144B2 (ja) * | 2022-09-02 | 2025-01-07 | カシオ計算機株式会社 | 光源装置及び光源装置の組立方法 |
-
1979
- 1979-01-19 JP JP583179U patent/JPS6246292Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS55105968U (enrdf_load_html_response) | 1980-07-24 |
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