JPS6244880B2 - - Google Patents
Info
- Publication number
- JPS6244880B2 JPS6244880B2 JP16703281A JP16703281A JPS6244880B2 JP S6244880 B2 JPS6244880 B2 JP S6244880B2 JP 16703281 A JP16703281 A JP 16703281A JP 16703281 A JP16703281 A JP 16703281A JP S6244880 B2 JPS6244880 B2 JP S6244880B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- holes
- manufacturing
- multilayer printed
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16703281A JPS5868999A (ja) | 1981-10-21 | 1981-10-21 | 多層プリント配線板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16703281A JPS5868999A (ja) | 1981-10-21 | 1981-10-21 | 多層プリント配線板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5868999A JPS5868999A (ja) | 1983-04-25 |
JPS6244880B2 true JPS6244880B2 (en, 2012) | 1987-09-22 |
Family
ID=15842120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16703281A Granted JPS5868999A (ja) | 1981-10-21 | 1981-10-21 | 多層プリント配線板の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5868999A (en, 2012) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01121065U (en, 2012) * | 1988-02-09 | 1989-08-16 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62186594A (ja) * | 1986-02-12 | 1987-08-14 | 日本電気株式会社 | 多層印刷配線板の製造方法 |
US10820427B2 (en) | 2013-03-15 | 2020-10-27 | Sanmina Corporation | Simultaneous and selective wide gap partitioning of via structures using plating resist |
US9781844B2 (en) | 2013-03-15 | 2017-10-03 | Sanmina Corporation | Simultaneous and selective wide gap partitioning of via structures using plating resist |
US9661758B2 (en) * | 2013-08-19 | 2017-05-23 | Sanmina Corporation | Methods of segmented through hole formation using dual diameter through hole edge trimming |
-
1981
- 1981-10-21 JP JP16703281A patent/JPS5868999A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01121065U (en, 2012) * | 1988-02-09 | 1989-08-16 |
Also Published As
Publication number | Publication date |
---|---|
JPS5868999A (ja) | 1983-04-25 |
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