JPS6244425B2 - - Google Patents

Info

Publication number
JPS6244425B2
JPS6244425B2 JP57025377A JP2537782A JPS6244425B2 JP S6244425 B2 JPS6244425 B2 JP S6244425B2 JP 57025377 A JP57025377 A JP 57025377A JP 2537782 A JP2537782 A JP 2537782A JP S6244425 B2 JPS6244425 B2 JP S6244425B2
Authority
JP
Japan
Prior art keywords
lead
lead frame
die pad
external
sectional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57025377A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58141548A (ja
Inventor
Shunichi Kon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Yamagata Ltd
Original Assignee
NEC Yamagata Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Yamagata Ltd filed Critical NEC Yamagata Ltd
Priority to JP57025377A priority Critical patent/JPS58141548A/ja
Publication of JPS58141548A publication Critical patent/JPS58141548A/ja
Publication of JPS6244425B2 publication Critical patent/JPS6244425B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP57025377A 1982-02-18 1982-02-18 半導体装置用リ−ドフレ−ム Granted JPS58141548A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57025377A JPS58141548A (ja) 1982-02-18 1982-02-18 半導体装置用リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57025377A JPS58141548A (ja) 1982-02-18 1982-02-18 半導体装置用リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS58141548A JPS58141548A (ja) 1983-08-22
JPS6244425B2 true JPS6244425B2 (fa) 1987-09-21

Family

ID=12164154

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57025377A Granted JPS58141548A (ja) 1982-02-18 1982-02-18 半導体装置用リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS58141548A (fa)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58170846U (ja) * 1982-05-07 1983-11-15 日本電気株式会社 半導体装置用リ−ドフレ−ム
FR2662000A1 (fr) * 1990-05-11 1991-11-15 Philips Composants Carte a microcircuit.

Also Published As

Publication number Publication date
JPS58141548A (ja) 1983-08-22

Similar Documents

Publication Publication Date Title
JPH04306867A (ja) リードフレーム及びその製造方法
US4486948A (en) Method for forming lead frame for integrated circuit devices
JPS6244425B2 (fa)
US5083186A (en) Semiconductor device lead frame with rounded edges
JP3290869B2 (ja) 半導体装置
JPS6211499B2 (fa)
JPS60120543A (ja) 半導体装置およびそれに用いるリ−ドフレ−ム
JPS62168615A (ja) 半導体装置のダイパツト成形金型
JPS638143Y2 (fa)
JPH03228339A (ja) ボンディングツール
JPS634354B2 (fa)
JPH0815192B2 (ja) 半導体装置
JPH0621247Y2 (ja) リ−ドレスチツプキヤリア
JPH0419805Y2 (fa)
JPH04196575A (ja) 半導体装置
JP2823334B2 (ja) 半導体装置
JP2825578B2 (ja) バンブを有する金属リードの製造装置
JPS6223094Y2 (fa)
JPS6230499B2 (fa)
JPH041739Y2 (fa)
JPH0294464A (ja) 半導体装置用リードフレーム
JPS6244531Y2 (fa)
JPH02280360A (ja) 半導体パッケージ
JPS6154259B2 (fa)
JP2511765Y2 (ja) リ―ドフレ―ム