JPS6244421B2 - - Google Patents

Info

Publication number
JPS6244421B2
JPS6244421B2 JP57211627A JP21162782A JPS6244421B2 JP S6244421 B2 JPS6244421 B2 JP S6244421B2 JP 57211627 A JP57211627 A JP 57211627A JP 21162782 A JP21162782 A JP 21162782A JP S6244421 B2 JPS6244421 B2 JP S6244421B2
Authority
JP
Japan
Prior art keywords
lead
frame
lead frame
collector
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57211627A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59100558A (ja
Inventor
Masaaki Shimotomai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP57211627A priority Critical patent/JPS59100558A/ja
Publication of JPS59100558A publication Critical patent/JPS59100558A/ja
Publication of JPS6244421B2 publication Critical patent/JPS6244421B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP57211627A 1982-11-30 1982-11-30 半導体装置用リ−ドフレ−ム Granted JPS59100558A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57211627A JPS59100558A (ja) 1982-11-30 1982-11-30 半導体装置用リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57211627A JPS59100558A (ja) 1982-11-30 1982-11-30 半導体装置用リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS59100558A JPS59100558A (ja) 1984-06-09
JPS6244421B2 true JPS6244421B2 (https=) 1987-09-21

Family

ID=16608900

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57211627A Granted JPS59100558A (ja) 1982-11-30 1982-11-30 半導体装置用リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS59100558A (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4523138B2 (ja) 2000-10-06 2010-08-11 ローム株式会社 半導体装置およびそれに用いるリードフレーム

Also Published As

Publication number Publication date
JPS59100558A (ja) 1984-06-09

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