JPS6244015B2 - - Google Patents
Info
- Publication number
- JPS6244015B2 JPS6244015B2 JP11938182A JP11938182A JPS6244015B2 JP S6244015 B2 JPS6244015 B2 JP S6244015B2 JP 11938182 A JP11938182 A JP 11938182A JP 11938182 A JP11938182 A JP 11938182A JP S6244015 B2 JPS6244015 B2 JP S6244015B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- liquid epoxy
- phenol
- group
- inorganic filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11938182A JPS598722A (ja) | 1982-07-07 | 1982-07-07 | 半導体封止用液状エポキシ樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11938182A JPS598722A (ja) | 1982-07-07 | 1982-07-07 | 半導体封止用液状エポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS598722A JPS598722A (ja) | 1984-01-18 |
| JPS6244015B2 true JPS6244015B2 (OSRAM) | 1987-09-17 |
Family
ID=14760096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11938182A Granted JPS598722A (ja) | 1982-07-07 | 1982-07-07 | 半導体封止用液状エポキシ樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS598722A (OSRAM) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01298752A (ja) * | 1988-05-27 | 1989-12-01 | Abisare:Kk | 導電回路用の封止剤 |
| US6495270B1 (en) | 1998-02-19 | 2002-12-17 | Hitachi Chemical Company, Ltd. | Compounds, hardening accelerator, resin composition, and electronic part device |
| JP2012167162A (ja) * | 2011-02-14 | 2012-09-06 | Sumitomo Bakelite Co Ltd | 液状封止樹脂組成物および液状封止樹脂組成物を用いた半導体装置 |
| EP3430630A1 (en) * | 2016-03-15 | 2019-01-23 | Huntsman Advanced Materials Licensing (Switzerland) GmbH | A process for the preparation of insulation systems for electrical engineering, the articles obtained therefrom and the use thereof |
-
1982
- 1982-07-07 JP JP11938182A patent/JPS598722A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS598722A (ja) | 1984-01-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1318571A (zh) | 半导体装置及其制法 | |
| JPH06345847A (ja) | エポキシ樹脂組成物及び半導体装置 | |
| JPS6244015B2 (OSRAM) | ||
| JPH05259316A (ja) | 樹脂封止型半導体装置 | |
| JP2000273280A (ja) | エポキシ樹脂組成物及び半導体装置 | |
| JP3102276B2 (ja) | エポキシ樹脂組成物の製造方法及び半導体封止用エポキシ樹脂組成物 | |
| JPS6238365B2 (OSRAM) | ||
| JPS6231735B2 (OSRAM) | ||
| JPH11172075A (ja) | エポキシ樹脂組成物及び半導体装置 | |
| JP3537224B2 (ja) | エポキシ樹脂系組成物及び樹脂封止型半導体装置 | |
| JPS60190418A (ja) | 半導体封止用液状エポキシ樹脂組成物 | |
| JPH1045872A (ja) | エポキシ樹脂組成物 | |
| JPH01188518A (ja) | エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置 | |
| JPH11286594A (ja) | 封止用樹脂組成物および半導体封止装置 | |
| JP2002194064A (ja) | 半導体封止用樹脂組成物、およびそれを用いた半導体装置 | |
| JPH07242731A (ja) | 半導体封止用エポキシ樹脂組成物 | |
| JPH1112442A (ja) | 封止用樹脂組成物および半導体封止装置 | |
| JP3417283B2 (ja) | 封止用のエポキシ樹脂組成物および半導体装置封止方法 | |
| JP2000273154A (ja) | エポキシ樹脂組成物及び半導体装置 | |
| JP3442545B2 (ja) | 熱硬化性樹脂組成物 | |
| JPH03115455A (ja) | 封止用樹脂組成物及び樹脂封止型半導体装置 | |
| JPH11166103A (ja) | 封止用樹脂組成物および半導体封止装置 | |
| JPS6377922A (ja) | 半導体封止用エポキシ樹脂組成物 | |
| JPS63248823A (ja) | エポキシ樹脂組成物及び樹脂封止型半導体装置 | |
| JP3649893B2 (ja) | 封止用樹脂組成物および半導体封止装置 |