JPS6243337B2 - - Google Patents

Info

Publication number
JPS6243337B2
JPS6243337B2 JP54131876A JP13187679A JPS6243337B2 JP S6243337 B2 JPS6243337 B2 JP S6243337B2 JP 54131876 A JP54131876 A JP 54131876A JP 13187679 A JP13187679 A JP 13187679A JP S6243337 B2 JPS6243337 B2 JP S6243337B2
Authority
JP
Japan
Prior art keywords
brazing material
plate
bonded
conductive plate
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54131876A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5656661A (en
Inventor
Masayuki Horie
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP13187679A priority Critical patent/JPS5656661A/ja
Publication of JPS5656661A publication Critical patent/JPS5656661A/ja
Publication of JPS6243337B2 publication Critical patent/JPS6243337B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/20—
    • H10W72/30—
    • H10W72/07511—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5363—
    • H10W72/5434—
    • H10W72/5449—
    • H10W72/59—
    • H10W72/884—
    • H10W72/934—
    • H10W90/753—
    • H10W90/754—

Landscapes

  • Wire Bonding (AREA)
JP13187679A 1979-10-15 1979-10-15 Insulation post in semiconductor device Granted JPS5656661A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13187679A JPS5656661A (en) 1979-10-15 1979-10-15 Insulation post in semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13187679A JPS5656661A (en) 1979-10-15 1979-10-15 Insulation post in semiconductor device

Publications (2)

Publication Number Publication Date
JPS5656661A JPS5656661A (en) 1981-05-18
JPS6243337B2 true JPS6243337B2 (cg-RX-API-DMAC10.html) 1987-09-12

Family

ID=15068199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13187679A Granted JPS5656661A (en) 1979-10-15 1979-10-15 Insulation post in semiconductor device

Country Status (1)

Country Link
JP (1) JPS5656661A (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5077102B2 (ja) * 2008-06-30 2012-11-21 三菱マテリアル株式会社 パワーモジュール用基板及びその製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54111467U (cg-RX-API-DMAC10.html) * 1978-01-25 1979-08-06

Also Published As

Publication number Publication date
JPS5656661A (en) 1981-05-18

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