JPS6242787B2 - - Google Patents
Info
- Publication number
- JPS6242787B2 JPS6242787B2 JP53161650A JP16165078A JPS6242787B2 JP S6242787 B2 JPS6242787 B2 JP S6242787B2 JP 53161650 A JP53161650 A JP 53161650A JP 16165078 A JP16165078 A JP 16165078A JP S6242787 B2 JPS6242787 B2 JP S6242787B2
- Authority
- JP
- Japan
- Prior art keywords
- polybutadiene
- weight
- copper
- copper foil
- molecular weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16165078A JPS5586745A (en) | 1978-12-23 | 1978-12-23 | Copperrcoated laminated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16165078A JPS5586745A (en) | 1978-12-23 | 1978-12-23 | Copperrcoated laminated board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5586745A JPS5586745A (en) | 1980-06-30 |
| JPS6242787B2 true JPS6242787B2 (cg-RX-API-DMAC7.html) | 1987-09-10 |
Family
ID=15739212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16165078A Granted JPS5586745A (en) | 1978-12-23 | 1978-12-23 | Copperrcoated laminated board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5586745A (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014087779A1 (ja) | 2012-12-03 | 2014-06-12 | 花王株式会社 | オルガノポリシロキサングラフトポリマー |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0691302B2 (ja) * | 1985-03-14 | 1994-11-14 | 株式会社東芝 | 金属コア印刷配線基板 |
| JP4310471B2 (ja) * | 2007-01-23 | 2009-08-12 | ナン ヤ プラスティクス コーポレーション | ポリブタジエン熱硬化性樹脂プリント回路基板組成物およびその製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4875684A (cg-RX-API-DMAC7.html) * | 1972-01-12 | 1973-10-12 | ||
| JPS50101862A (cg-RX-API-DMAC7.html) * | 1974-01-10 | 1975-08-12 | ||
| JPS51144475A (en) * | 1975-06-05 | 1976-12-11 | Matsushita Electric Works Ltd | A process for manufacturing copper-clad laminates |
| JPS53145891A (en) * | 1977-05-26 | 1978-12-19 | Fujitsu Ltd | Printed circuit board |
-
1978
- 1978-12-23 JP JP16165078A patent/JPS5586745A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014087779A1 (ja) | 2012-12-03 | 2014-06-12 | 花王株式会社 | オルガノポリシロキサングラフトポリマー |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5586745A (en) | 1980-06-30 |
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