JPS5586745A - Copperrcoated laminated board - Google Patents

Copperrcoated laminated board

Info

Publication number
JPS5586745A
JPS5586745A JP16165078A JP16165078A JPS5586745A JP S5586745 A JPS5586745 A JP S5586745A JP 16165078 A JP16165078 A JP 16165078A JP 16165078 A JP16165078 A JP 16165078A JP S5586745 A JPS5586745 A JP S5586745A
Authority
JP
Japan
Prior art keywords
copperrcoated
laminated board
laminated
board
copperrcoated laminated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16165078A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6242787B2 (cg-RX-API-DMAC7.html
Inventor
Kazumasa Saitou
Isao Watanabe
Norio Saruwatari
Katsura Adachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16165078A priority Critical patent/JPS5586745A/ja
Publication of JPS5586745A publication Critical patent/JPS5586745A/ja
Publication of JPS6242787B2 publication Critical patent/JPS6242787B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP16165078A 1978-12-23 1978-12-23 Copperrcoated laminated board Granted JPS5586745A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16165078A JPS5586745A (en) 1978-12-23 1978-12-23 Copperrcoated laminated board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16165078A JPS5586745A (en) 1978-12-23 1978-12-23 Copperrcoated laminated board

Publications (2)

Publication Number Publication Date
JPS5586745A true JPS5586745A (en) 1980-06-30
JPS6242787B2 JPS6242787B2 (cg-RX-API-DMAC7.html) 1987-09-10

Family

ID=15739212

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16165078A Granted JPS5586745A (en) 1978-12-23 1978-12-23 Copperrcoated laminated board

Country Status (1)

Country Link
JP (1) JPS5586745A (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61208889A (ja) * 1985-03-14 1986-09-17 株式会社東芝 金属コア印刷配線基板
JP2008181909A (ja) * 2007-01-23 2008-08-07 Nan Ya Plastics Corp ポリブタジエン熱硬化性樹脂プリント回路基板組成物およびその製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6071491B2 (ja) 2012-12-03 2017-02-01 花王株式会社 毛髪化粧料

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4875684A (cg-RX-API-DMAC7.html) * 1972-01-12 1973-10-12
JPS50101862A (cg-RX-API-DMAC7.html) * 1974-01-10 1975-08-12
JPS51144475A (en) * 1975-06-05 1976-12-11 Matsushita Electric Works Ltd A process for manufacturing copper-clad laminates
JPS53145891A (en) * 1977-05-26 1978-12-19 Fujitsu Ltd Printed circuit board

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4875684A (cg-RX-API-DMAC7.html) * 1972-01-12 1973-10-12
JPS50101862A (cg-RX-API-DMAC7.html) * 1974-01-10 1975-08-12
JPS51144475A (en) * 1975-06-05 1976-12-11 Matsushita Electric Works Ltd A process for manufacturing copper-clad laminates
JPS53145891A (en) * 1977-05-26 1978-12-19 Fujitsu Ltd Printed circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61208889A (ja) * 1985-03-14 1986-09-17 株式会社東芝 金属コア印刷配線基板
JP2008181909A (ja) * 2007-01-23 2008-08-07 Nan Ya Plastics Corp ポリブタジエン熱硬化性樹脂プリント回路基板組成物およびその製造方法

Also Published As

Publication number Publication date
JPS6242787B2 (cg-RX-API-DMAC7.html) 1987-09-10

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