JPS6242548Y2 - - Google Patents
Info
- Publication number
- JPS6242548Y2 JPS6242548Y2 JP1981008549U JP854981U JPS6242548Y2 JP S6242548 Y2 JPS6242548 Y2 JP S6242548Y2 JP 1981008549 U JP1981008549 U JP 1981008549U JP 854981 U JP854981 U JP 854981U JP S6242548 Y2 JPS6242548 Y2 JP S6242548Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- center
- board
- substrates
- predetermined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 27
- 239000004020 conductor Substances 0.000 claims description 9
- 238000005452 bending Methods 0.000 claims description 3
- 230000009977 dual effect Effects 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000011295 pitch Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981008549U JPS6242548Y2 (US06826419-20041130-M00005.png) | 1981-01-23 | 1981-01-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1981008549U JPS6242548Y2 (US06826419-20041130-M00005.png) | 1981-01-23 | 1981-01-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57121173U JPS57121173U (US06826419-20041130-M00005.png) | 1982-07-28 |
| JPS6242548Y2 true JPS6242548Y2 (US06826419-20041130-M00005.png) | 1987-10-31 |
Family
ID=29806697
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1981008549U Expired JPS6242548Y2 (US06826419-20041130-M00005.png) | 1981-01-23 | 1981-01-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6242548Y2 (US06826419-20041130-M00005.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0236216Y2 (US06826419-20041130-M00005.png) * | 1985-02-22 | 1990-10-02 | ||
| JP6723567B2 (ja) * | 2018-10-22 | 2020-07-15 | 日本圧着端子製造株式会社 | コネクタ |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55167680U (US06826419-20041130-M00005.png) * | 1979-05-18 | 1980-12-02 |
-
1981
- 1981-01-23 JP JP1981008549U patent/JPS6242548Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57121173U (US06826419-20041130-M00005.png) | 1982-07-28 |
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