JPS6242035B2 - - Google Patents

Info

Publication number
JPS6242035B2
JPS6242035B2 JP58093997A JP9399783A JPS6242035B2 JP S6242035 B2 JPS6242035 B2 JP S6242035B2 JP 58093997 A JP58093997 A JP 58093997A JP 9399783 A JP9399783 A JP 9399783A JP S6242035 B2 JPS6242035 B2 JP S6242035B2
Authority
JP
Japan
Prior art keywords
tin
acid
copper
ions
stripping solution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58093997A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59219475A (ja
Inventor
Yutaka Kawabe
Toyoki Motai
Masanori Kishimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
METSUKU KK
Original Assignee
METSUKU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by METSUKU KK filed Critical METSUKU KK
Priority to JP9399783A priority Critical patent/JPS59219475A/ja
Publication of JPS59219475A publication Critical patent/JPS59219475A/ja
Publication of JPS6242035B2 publication Critical patent/JPS6242035B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/30—Acidic compositions for etching other metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • ing And Chemical Polishing (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP9399783A 1983-05-30 1983-05-30 錫または錫合金の剥離液 Granted JPS59219475A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9399783A JPS59219475A (ja) 1983-05-30 1983-05-30 錫または錫合金の剥離液

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9399783A JPS59219475A (ja) 1983-05-30 1983-05-30 錫または錫合金の剥離液

Publications (2)

Publication Number Publication Date
JPS59219475A JPS59219475A (ja) 1984-12-10
JPS6242035B2 true JPS6242035B2 (enrdf_load_stackoverflow) 1987-09-05

Family

ID=14098038

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9399783A Granted JPS59219475A (ja) 1983-05-30 1983-05-30 錫または錫合金の剥離液

Country Status (1)

Country Link
JP (1) JPS59219475A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4580085B2 (ja) * 2000-10-26 2010-11-10 メック株式会社 金属スズまたはスズ合金をエッチングする方法ならびに金属スズまたはスズ合金のエッチング液
AP2016009105A0 (en) * 2010-04-15 2016-03-31 Entegris Inc Method for recycling of obsolete printed circuit boards
CN105177575A (zh) * 2015-10-01 2015-12-23 常州市奥普泰科光电有限公司 一种退去黄铜表面锡镍镀层的退镀方法
JP7035883B2 (ja) * 2018-07-27 2022-03-15 三菱マテリアル株式会社 剥離液

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5216695B2 (enrdf_load_stackoverflow) * 1973-05-29 1977-05-11
JPS5240292A (en) * 1975-09-26 1977-03-29 Tokyu Car Corp Shift device
JPS57164984A (en) * 1981-04-06 1982-10-09 Metsuku Kk Exfoliating solution for tin or tin alloy

Also Published As

Publication number Publication date
JPS59219475A (ja) 1984-12-10

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