JPS6241425B2 - - Google Patents
Info
- Publication number
- JPS6241425B2 JPS6241425B2 JP54044927A JP4492779A JPS6241425B2 JP S6241425 B2 JPS6241425 B2 JP S6241425B2 JP 54044927 A JP54044927 A JP 54044927A JP 4492779 A JP4492779 A JP 4492779A JP S6241425 B2 JPS6241425 B2 JP S6241425B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- resistance
- type
- impurity
- oxide film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 22
- 239000012535 impurity Substances 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000005468 ion implantation Methods 0.000 description 15
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 11
- 229910052796 boron Inorganic materials 0.000 description 11
- 238000009792 diffusion process Methods 0.000 description 10
- 238000007796 conventional method Methods 0.000 description 6
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
- H01L21/26513—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
- H01L21/26513—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
- H01L21/2652—Through-implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8222—Bipolar technology
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0641—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region without components of the field effect type
- H01L27/0647—Bipolar transistors in combination with diodes, or capacitors, or resistors, e.g. vertical bipolar transistor and bipolar lateral transistor and resistor
- H01L27/0652—Vertical bipolar transistor in combination with diodes, or capacitors, or resistors
- H01L27/0658—Vertical bipolar transistor in combination with resistors or capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/8605—Resistors with PN junctions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- High Energy & Nuclear Physics (AREA)
- Manufacturing & Machinery (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Ceramic Engineering (AREA)
- Semiconductor Integrated Circuits (AREA)
- Element Separation (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4492779A JPS55138267A (en) | 1979-04-12 | 1979-04-12 | Manufacture of semiconductor integrated circuit containing resistance element |
| US06/349,532 US4418469A (en) | 1979-04-12 | 1982-02-17 | Method of simultaneously forming buried resistors and bipolar transistors by ion implantation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4492779A JPS55138267A (en) | 1979-04-12 | 1979-04-12 | Manufacture of semiconductor integrated circuit containing resistance element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55138267A JPS55138267A (en) | 1980-10-28 |
| JPS6241425B2 true JPS6241425B2 (US06633600-20031014-M00021.png) | 1987-09-02 |
Family
ID=12705098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4492779A Granted JPS55138267A (en) | 1979-04-12 | 1979-04-12 | Manufacture of semiconductor integrated circuit containing resistance element |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4418469A (US06633600-20031014-M00021.png) |
| JP (1) | JPS55138267A (US06633600-20031014-M00021.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63170042U (US06633600-20031014-M00021.png) * | 1987-04-28 | 1988-11-04 | ||
| JPH0570737U (ja) * | 1992-02-29 | 1993-09-24 | 今泉工業株式会社 | パンチプレス装置のワーク排出装置 |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0093304B1 (en) * | 1982-04-19 | 1986-01-15 | Matsushita Electric Industrial Co., Ltd. | Semiconductor ic and method of making the same |
| DE3274699D1 (en) * | 1982-09-20 | 1987-01-22 | Itt Ind Gmbh Deutsche | Method of making a monolithic integrated circuit with at least one bipolar planar transistor |
| JPS60258964A (ja) * | 1984-06-06 | 1985-12-20 | Hitachi Ltd | 半導体装置の製造方法 |
| NL8403111A (nl) * | 1984-10-12 | 1986-05-01 | Philips Nv | Werkwijze ter vervaardiging van een bipolaire transistor met emitterserieweerstanden, en transistor vervaardigd volgens de werkwijze. |
| US4898837A (en) * | 1987-11-19 | 1990-02-06 | Sanyo Electric Co., Ltd. | Method of fabricating a semiconductor integrated circuit |
| US4857476A (en) * | 1988-01-26 | 1989-08-15 | Hewlett-Packard Company | Bipolar transistor process using sidewall spacer for aligning base insert |
| JPH0831473B2 (ja) * | 1988-05-20 | 1996-03-27 | 富士通株式会社 | 半導体装置 |
| US5504363A (en) * | 1992-09-02 | 1996-04-02 | Motorola Inc. | Semiconductor device |
| JP3104587B2 (ja) * | 1995-10-05 | 2000-10-30 | 日本電気株式会社 | 半導体装置の製造方法 |
| US5679593A (en) * | 1996-02-01 | 1997-10-21 | Micron Technology, Inc. | Method of fabricating a high resistance integrated circuit resistor |
| US5883566A (en) * | 1997-02-24 | 1999-03-16 | International Business Machines Corporation | Noise-isolated buried resistor |
| JPH10242394A (ja) * | 1997-02-27 | 1998-09-11 | Matsushita Electron Corp | 半導体装置の製造方法 |
| DE69737947D1 (de) * | 1997-05-20 | 2007-09-06 | St Microelectronics Srl | Herstellungsverfahren für integrierten Schaltkreis mit MOS-Transistoren von hoher Durchbruchspannung und mit Präzisionswiderständen |
| US6100153A (en) * | 1998-01-20 | 2000-08-08 | International Business Machines Corporation | Reliable diffusion resistor and diffusion capacitor |
| US6069048A (en) * | 1998-09-30 | 2000-05-30 | Lsi Logic Corporation | Reduction of silicon defect induced failures as a result of implants in CMOS and other integrated circuits |
| US6246116B1 (en) * | 1999-05-21 | 2001-06-12 | United Microelectronics Corp. | Buried wiring line |
| US6900091B2 (en) * | 2002-08-14 | 2005-05-31 | Advanced Analogic Technologies, Inc. | Isolated complementary MOS devices in epi-less substrate |
| FR2884050B1 (fr) * | 2005-04-01 | 2007-07-20 | St Microelectronics Sa | Circuit integre comprenant un substrat et une resistance |
| US7910450B2 (en) * | 2006-02-22 | 2011-03-22 | International Business Machines Corporation | Method of fabricating a precision buried resistor |
| DE102008049732B4 (de) * | 2008-09-30 | 2011-06-09 | Amd Fab 36 Limited Liability Company & Co. Kg | Halbleiterbauelement mit vergrabenem Polysiliziumwiderstand sowie Verfahren zu seiner Herstellung |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA1056513A (en) * | 1975-06-19 | 1979-06-12 | Benjamin J. Sloan (Jr.) | Integrated logic circuit and method of fabrication |
| US4021270A (en) * | 1976-06-28 | 1977-05-03 | Motorola, Inc. | Double master mask process for integrated circuit manufacture |
| US4228450A (en) * | 1977-10-25 | 1980-10-14 | International Business Machines Corporation | Buried high sheet resistance structure for high density integrated circuits with reach through contacts |
-
1979
- 1979-04-12 JP JP4492779A patent/JPS55138267A/ja active Granted
-
1982
- 1982-02-17 US US06/349,532 patent/US4418469A/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63170042U (US06633600-20031014-M00021.png) * | 1987-04-28 | 1988-11-04 | ||
| JPH0570737U (ja) * | 1992-02-29 | 1993-09-24 | 今泉工業株式会社 | パンチプレス装置のワーク排出装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| US4418469A (en) | 1983-12-06 |
| JPS55138267A (en) | 1980-10-28 |
