JPS6240749A - ピングリツドアレイ - Google Patents
ピングリツドアレイInfo
- Publication number
- JPS6240749A JPS6240749A JP18090185A JP18090185A JPS6240749A JP S6240749 A JPS6240749 A JP S6240749A JP 18090185 A JP18090185 A JP 18090185A JP 18090185 A JP18090185 A JP 18090185A JP S6240749 A JPS6240749 A JP S6240749A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- pins
- pin
- grid array
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920006015 heat resistant resin Polymers 0.000 claims abstract description 9
- 238000007789 sealing Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 238000000465 moulding Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 238000003491 array Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000035939 shock Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18090185A JPS6240749A (ja) | 1985-08-16 | 1985-08-16 | ピングリツドアレイ |
| EP86108770A EP0218796B1 (en) | 1985-08-16 | 1986-06-27 | Semiconductor device comprising a plug-in-type package |
| DE8686108770T DE3675321D1 (de) | 1985-08-16 | 1986-06-27 | Halbleiteranordnung mit packung vom steckerstifttyp. |
| US06/880,832 US4823234A (en) | 1985-08-16 | 1986-07-01 | Semiconductor device and its manufacture |
| KR1019860006161A KR870002647A (ko) | 1985-08-16 | 1986-07-28 | 반도체장치 및 그 제조방법 |
| CN198686105249A CN86105249A (zh) | 1985-08-16 | 1986-08-16 | 半导体器件及其制造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18090185A JPS6240749A (ja) | 1985-08-16 | 1985-08-16 | ピングリツドアレイ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6240749A true JPS6240749A (ja) | 1987-02-21 |
| JPH0533535B2 JPH0533535B2 (enrdf_load_html_response) | 1993-05-19 |
Family
ID=16091288
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18090185A Granted JPS6240749A (ja) | 1985-08-16 | 1985-08-16 | ピングリツドアレイ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6240749A (enrdf_load_html_response) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62189743A (ja) * | 1986-02-14 | 1987-08-19 | Matsushita Electric Works Ltd | 配線回路体 |
| JPS62189742A (ja) * | 1986-02-14 | 1987-08-19 | Matsushita Electric Works Ltd | ピングリツドアレイ |
| JPH01201941A (ja) * | 1988-02-05 | 1989-08-14 | Citizen Watch Co Ltd | 樹脂封止型半導体装置及びその製造方法 |
-
1985
- 1985-08-16 JP JP18090185A patent/JPS6240749A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62189743A (ja) * | 1986-02-14 | 1987-08-19 | Matsushita Electric Works Ltd | 配線回路体 |
| JPS62189742A (ja) * | 1986-02-14 | 1987-08-19 | Matsushita Electric Works Ltd | ピングリツドアレイ |
| JPH01201941A (ja) * | 1988-02-05 | 1989-08-14 | Citizen Watch Co Ltd | 樹脂封止型半導体装置及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0533535B2 (enrdf_load_html_response) | 1993-05-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5557150A (en) | Overmolded semiconductor package | |
| US6528869B1 (en) | Semiconductor package with molded substrate and recessed input/output terminals | |
| US5736780A (en) | Semiconductor device having circuit pattern along outer periphery of sealing resin and related processes | |
| US6900535B2 (en) | BGA/LGA with built in heat slug/spreader | |
| US7323767B2 (en) | Standoffs for centralizing internals in packaging process | |
| US4823234A (en) | Semiconductor device and its manufacture | |
| US7193329B2 (en) | Semiconductor device | |
| JP5887650B2 (ja) | 半導体パッケージおよびこの製造方法 | |
| US4618739A (en) | Plastic chip carrier package | |
| EP1096567A2 (en) | BGA package and method for fabricating the same | |
| JPH08250653A (ja) | マルチチップモジュールパッケージ | |
| JPH10261753A (ja) | 樹脂封止型半導体装置 | |
| US5989935A (en) | Column grid array for semiconductor packaging and method | |
| EP0563264B1 (en) | Leadless pad array chip carrier | |
| KR19990083251A (ko) | 얇은리세스부및두꺼운평면부를갖는반도체칩용패키지및그의제조방법 | |
| JP3656861B2 (ja) | 半導体集積回路装置及び半導体集積回路装置の製造方法 | |
| JPS6240749A (ja) | ピングリツドアレイ | |
| JPH08279571A (ja) | 半導体装置 | |
| KR100199286B1 (ko) | 홈이 형성된 인쇄 회로 기판을 갖는 칩 스케일 패키지 | |
| JPS6240754A (ja) | ピングリッドアレイ | |
| JPH08148526A (ja) | 半導体装置 | |
| WO1999056313A1 (fr) | Dispositif semi-conducteur et son procede de production | |
| JPH08279570A (ja) | 半導体装置 | |
| JP2652222B2 (ja) | 電子部品搭載用基板 | |
| JP3404586B2 (ja) | 半導体装置およびその製造方法 |