JPS6240445Y2 - - Google Patents
Info
- Publication number
- JPS6240445Y2 JPS6240445Y2 JP1980177227U JP17722780U JPS6240445Y2 JP S6240445 Y2 JPS6240445 Y2 JP S6240445Y2 JP 1980177227 U JP1980177227 U JP 1980177227U JP 17722780 U JP17722780 U JP 17722780U JP S6240445 Y2 JPS6240445 Y2 JP S6240445Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- lead
- groove
- resin case
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 description 23
- 229920005989 resin Polymers 0.000 description 23
- 239000004065 semiconductor Substances 0.000 description 10
- 239000000758 substrate Substances 0.000 description 9
- 239000000945 filler Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000000465 moulding Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980177227U JPS6240445Y2 (en, 2012) | 1980-12-09 | 1980-12-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1980177227U JPS6240445Y2 (en, 2012) | 1980-12-09 | 1980-12-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57100239U JPS57100239U (en, 2012) | 1982-06-19 |
JPS6240445Y2 true JPS6240445Y2 (en, 2012) | 1987-10-16 |
Family
ID=29970916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1980177227U Expired JPS6240445Y2 (en, 2012) | 1980-12-09 | 1980-12-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6240445Y2 (en, 2012) |
-
1980
- 1980-12-09 JP JP1980177227U patent/JPS6240445Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS57100239U (en, 2012) | 1982-06-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6740814B2 (en) | Wiring connection method and wiring connection structure | |
JP4709454B2 (ja) | 電子的な制御装置 | |
JP3611548B2 (ja) | スイッチング電源とその製造方法 | |
JP6044473B2 (ja) | 電子装置およびその電子装置の製造方法 | |
JPH07297575A (ja) | パワーモジュール装置 | |
JP2004039858A (ja) | 電力回路部の防水方法及び電力回路部をもつパワーモジュール | |
EP3589094A1 (en) | Electronic unit and method of making the same | |
US4738024A (en) | Method of making a heat dissipating assembly | |
JPH06334358A (ja) | 電装ユニット及びその組立方法 | |
JPS6240445Y2 (en, 2012) | ||
JP2001085120A (ja) | コネクタ | |
JP2010272637A (ja) | 電子部品の取付構造とその取付方法 | |
JPH08148842A (ja) | 電子機器 | |
JP4795843B2 (ja) | プリント基板実装品 | |
JPH0451486Y2 (en, 2012) | ||
JPH0617353Y2 (ja) | 電子機器の筐体構造 | |
JP2015002323A (ja) | 電子装置 | |
JP2574605Y2 (ja) | 複合半導体装置 | |
JPH0132377Y2 (en, 2012) | ||
JPH1092528A (ja) | 回路基板内蔵コネクタ | |
JPS6034840B2 (ja) | プリント基板収納装置 | |
JPS6237322Y2 (en, 2012) | ||
JPH07120863B2 (ja) | 電子回路装置 | |
JP3799830B2 (ja) | 半導体装置のパッケージ | |
JPH0343756Y2 (en, 2012) |