JPS6240431Y2 - - Google Patents
Info
- Publication number
- JPS6240431Y2 JPS6240431Y2 JP14076481U JP14076481U JPS6240431Y2 JP S6240431 Y2 JPS6240431 Y2 JP S6240431Y2 JP 14076481 U JP14076481 U JP 14076481U JP 14076481 U JP14076481 U JP 14076481U JP S6240431 Y2 JPS6240431 Y2 JP S6240431Y2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- susceptor
- wafers
- chuck
- heater block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 235000012431 wafers Nutrition 0.000 claims description 65
- 239000004065 semiconductor Substances 0.000 claims description 10
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000003860 storage Methods 0.000 description 15
- 239000007789 gas Substances 0.000 description 14
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 229910052760 oxygen Inorganic materials 0.000 description 4
- 230000001105 regulatory effect Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14076481U JPS5846443U (ja) | 1981-09-22 | 1981-09-22 | 半導体製造装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14076481U JPS5846443U (ja) | 1981-09-22 | 1981-09-22 | 半導体製造装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5846443U JPS5846443U (ja) | 1983-03-29 |
| JPS6240431Y2 true JPS6240431Y2 (cs) | 1987-10-16 |
Family
ID=29933909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14076481U Granted JPS5846443U (ja) | 1981-09-22 | 1981-09-22 | 半導体製造装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5846443U (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2728766B2 (ja) * | 1990-07-18 | 1998-03-18 | 株式会社東芝 | 半導体の処理方法およびその装置 |
-
1981
- 1981-09-22 JP JP14076481U patent/JPS5846443U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5846443U (ja) | 1983-03-29 |
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