JPS6240368B2 - - Google Patents

Info

Publication number
JPS6240368B2
JPS6240368B2 JP13765882A JP13765882A JPS6240368B2 JP S6240368 B2 JPS6240368 B2 JP S6240368B2 JP 13765882 A JP13765882 A JP 13765882A JP 13765882 A JP13765882 A JP 13765882A JP S6240368 B2 JPS6240368 B2 JP S6240368B2
Authority
JP
Japan
Prior art keywords
epoxy resin
inorganic filler
coupling agent
silane coupling
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP13765882A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5927945A (ja
Inventor
Takamitsu Fujimoto
Juzo Kanegae
Torahiko Ando
Norimoto Moriwaki
Shohei Eto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13765882A priority Critical patent/JPS5927945A/ja
Publication of JPS5927945A publication Critical patent/JPS5927945A/ja
Publication of JPS6240368B2 publication Critical patent/JPS6240368B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
JP13765882A 1982-08-05 1982-08-05 半導体封止用液状エポキシ樹脂組成物 Granted JPS5927945A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13765882A JPS5927945A (ja) 1982-08-05 1982-08-05 半導体封止用液状エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13765882A JPS5927945A (ja) 1982-08-05 1982-08-05 半導体封止用液状エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS5927945A JPS5927945A (ja) 1984-02-14
JPS6240368B2 true JPS6240368B2 (enExample) 1987-08-27

Family

ID=15203782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13765882A Granted JPS5927945A (ja) 1982-08-05 1982-08-05 半導体封止用液状エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS5927945A (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62149743A (ja) * 1985-12-25 1987-07-03 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂成形材料
JPS63225657A (ja) * 1986-10-28 1988-09-20 Calp Corp 複合樹脂組成物
JPS63202621A (ja) * 1987-02-18 1988-08-22 Matsushita Electric Works Ltd エポキシ樹脂成形材料
JPH0668012B2 (ja) * 1987-09-15 1994-08-31 インターナショナル・ビジネス・マシーンズ・コーポレーション 封止用組成物及び前記組成物を用いた電子装置
DE68928154T2 (de) * 1988-04-23 1997-10-30 Nippon Electric Co Fingerabdruckverarbeitungssystem, geeignet für das Ermitteln des Kernes eines Fingerabdruckbildes durch Krümmungsparameter
JP2776757B2 (ja) 1995-04-04 1998-07-16 日本電気ソフトウェア株式会社 指紋指頭軸方向検出装置
KR100624603B1 (ko) 2000-03-31 2006-09-19 히다치 가세고교 가부시끼가이샤 신규한 실리콘 중합체의 제조 방법, 이 방법에 의해제조된 실리콘 중합체, 열경화성 수지 조성물, 수지 필름,절연 재료 부착 금속박, 양면 금속박 부착 절연 필름,금속장 적층판, 다층 금속장 적층판 및 다층 프린트 배선판
US7012120B2 (en) 2000-03-31 2006-03-14 Henkel Corporation Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent
US20050288458A1 (en) 2002-07-29 2005-12-29 Klemarczyk Philip T Reworkable thermosetting resin composition
CN1232515C (zh) * 2000-03-31 2005-12-21 亨凯尔公司 包含环氧乙烷或硫杂丙环的树脂和固化剂的可再加工的组合物
JP4618407B2 (ja) * 2004-05-27 2011-01-26 信越化学工業株式会社 半導体封止用エポキシ樹脂組成物及び半導体装置
JP5256614B2 (ja) * 2006-01-19 2013-08-07 日立化成株式会社 エポキシ樹脂組成物及び電子部品装置
JP4904928B2 (ja) * 2006-05-30 2012-03-28 横浜ゴム株式会社 注型用硬化性樹脂組成物およびタイヤ空気圧センサー
JP5520183B2 (ja) * 2010-09-30 2014-06-11 積水化学工業株式会社 樹脂組成物、樹脂シート及び積層構造体

Also Published As

Publication number Publication date
JPS5927945A (ja) 1984-02-14

Similar Documents

Publication Publication Date Title
US6162878A (en) Semiconductor encapsulating epoxy resin composition and semiconductor device
JPS6240368B2 (enExample)
JPH11310688A (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2000034393A (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JPS6218565B2 (enExample)
JP7454906B2 (ja) アンダーフィル材、電子部品装置及び電子部品装置の製造方法
JPS5948942A (ja) 樹脂封止型半導体装置
JPS62236821A (ja) エポキシ樹脂組成物
JPH09255812A (ja) 樹脂組成物
JPS6325009B2 (enExample)
JPS59197421A (ja) 硬化性エポキシ樹脂組成物
JPH0977958A (ja) エポキシ樹脂組成物および半導体装置
JPS583382B2 (ja) 樹脂封止型半導体装置
JPH09235452A (ja) 半導体封止用エポキシ樹脂組成物
JPS6070781A (ja) 樹脂封止型発光装置
JP2560469B2 (ja) エポキシ系樹脂組成物
JP3871025B2 (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置
JPH08199045A (ja) エポキシ樹脂組成物の製造方法並びにその樹脂組成物を用いた半導体装置
JPH0379370B2 (enExample)
JP3824064B2 (ja) 半導体封止用難燃性エポキシ樹脂組成物及び半導体装置
JP3824063B2 (ja) 半導体封止用難燃性エポキシ樹脂組成物及び半導体装置
JP7455017B2 (ja) アンダーフィル材、電子部品装置及び電子部品装置の製造方法
JP2643547B2 (ja) 半導体封止用エポキシ樹脂組成物
JPH0656970A (ja) エポキシ樹脂組成物および半導体封止装置
JP2877134B2 (ja) エポキシ樹脂組成物