JPS623978B2 - - Google Patents
Info
- Publication number
- JPS623978B2 JPS623978B2 JP11418180A JP11418180A JPS623978B2 JP S623978 B2 JPS623978 B2 JP S623978B2 JP 11418180 A JP11418180 A JP 11418180A JP 11418180 A JP11418180 A JP 11418180A JP S623978 B2 JPS623978 B2 JP S623978B2
- Authority
- JP
- Japan
- Prior art keywords
- tape
- bonding
- semiconductor
- tape carrier
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 8
- 239000008188 pellet Substances 0.000 description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000000969 carrier Substances 0.000 description 4
- 230000002950 deficient Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11418180A JPS5737866A (en) | 1980-08-20 | 1980-08-20 | Tape carrier for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11418180A JPS5737866A (en) | 1980-08-20 | 1980-08-20 | Tape carrier for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5737866A JPS5737866A (en) | 1982-03-02 |
| JPS623978B2 true JPS623978B2 (ko) | 1987-01-28 |
Family
ID=14631214
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11418180A Granted JPS5737866A (en) | 1980-08-20 | 1980-08-20 | Tape carrier for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5737866A (ko) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020017071A1 (ja) | 2018-07-18 | 2020-01-23 | 株式会社アスカネット | 立体像結像装置の製造方法及び立体像結像装置 |
| US11402654B2 (en) | 2017-06-01 | 2022-08-02 | Asukanet Company, Ltd. | Method for manufacturing stereoscopic image forming device, and stereoscopic image forming device |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4721992A (en) * | 1986-06-26 | 1988-01-26 | National Semiconductor Corporation | Hinge tape |
| JPH0754813B2 (ja) * | 1986-08-29 | 1995-06-07 | 株式会社東芝 | フイルムキヤリア基板 |
| JP2755229B2 (ja) * | 1995-10-06 | 1998-05-20 | セイコーエプソン株式会社 | 電子回路基板部品 |
-
1980
- 1980-08-20 JP JP11418180A patent/JPS5737866A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11402654B2 (en) | 2017-06-01 | 2022-08-02 | Asukanet Company, Ltd. | Method for manufacturing stereoscopic image forming device, and stereoscopic image forming device |
| WO2020017071A1 (ja) | 2018-07-18 | 2020-01-23 | 株式会社アスカネット | 立体像結像装置の製造方法及び立体像結像装置 |
| KR20210028698A (ko) | 2018-07-18 | 2021-03-12 | 가부시키가이샤 아스카넷토 | 입체상 결상 장치의 제조 방법 및 입체상 결상 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5737866A (en) | 1982-03-02 |
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