JPS6237823A - Laminate board for electricity - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention] 【Technical field】

The present invention relates to an electrical laminate used for magnetic equipment, electronic equipment, computing equipment, communication equipment, etc. [Background technology] Conventionally, printed wiring boards starting from electrical laminates used in electrical equipment, etc., use a photo-developable solder resist. However, when the back side was exposed, peeling by the solvent was often inhibited. As a countermeasure to this problem, reducing the amount of UV irradiation will reduce the inherent abrasion resistance, solvent resistance, and moisture resistance of the resist ink.Also, if the amount of back pressure UV irradiation is excessive and mechanical polishing is forced, Kaede V If the cyst is peeled off, the required resist surface may be damaged, and abrasive materials, solvent residues, etc. may adhere to the surface of the printed wiring board, leading to quality defects when the next step is carried out. Furthermore, there is a method of making electrical laminates black, but this requires the addition of a carbon-based colorant, which is unsuitable for fine patterns and has not been used.

[Purpose of the invention]

An object of the present invention is to provide an electrical laminate that does not cause resist ink lining and provides a printed wiring board with excellent abrasion resistance, thermal shock resistance, moisture resistance, and insulation resistance.

[Disclosure of the invention]

The present invention is an electrical laminate that is characterized by absorbing light with a wavelength of 40G to 500gJl, so the resist ink can be completely cured by irradiation with ultraviolet rays using a photo-development type solder Vi), and the resist ink can be completely cured by development. The present invention will be described in detail below. The ultraviolet absorbers used in the present invention include salicylic acid-based, benzophenone-based, benzotriazole-based, hydroquine benzoate-based, and cyanoacrylate thread rings that absorb light with a wavelength of 400 to 500 m. It is necessary that The amount of the ultraviolet absorber is preferably 0, b to 3. It is desirable to have a good body part.
That is, if the amount is less than 0.6 parts, the light absorption effect tends to decrease, and if it exceeds 3.5 parts, the moisture resistance 1 strength of the laminate itself tends to decrease. For electrical laminates, phenolic resin is used as the resin for laminates,
Cresol resin, Evoki V resin, unsaturated polyester resin, melamine resin, polyimide. Polybutadiene, polyamide, polyamideimide, polyphenylene sulfide, polyphenylene oxide,
Polysulfone, polybutylene tin phthalate, polyether ether ketone, fluorinated resin, etc. alone, modified products, mixtures, etc. are used, and if necessary, water, methyl alcohol, acetone, V-chlorohexanone, styrene-specific compounds are used to adjust the viscosity. It is preferable to use Evoki V resin, which has a solvent added to it, but has excellent light transmittance.As the base material for the laminate, inorganic fibers such as glass and asbestos, polyester, polyamide, and polyvinyl alcohol can be used. −'Woven fabrics made of organic synthetic fibers such as acrylic and natural fibers such as cotton;
It is preferable to use a nonwoven fabric, matte, paper, or a combination of these substrates, and it is desirable to use a glass cloth with excellent light transmittance. In this way, the required number of resin-impregnated base materials impregnated with the resin for laminates are stacked, and if necessary, metal foil is arranged on the upper and/or lower surfaces of the laminates, and then the laminate is laminated and integrated. It is. The ultraviolet absorber is preferably used by being added to the resin for the laminate, and b is not particularly limited and can be attached to the base material for the laminate. The present invention will be explained below based on examples. Example 1 Epoxy trji fat varnish, 2, '! A glass cloth with a thickness of 0.2 fins was impregnated with a resin for laminates in which o and ag of Hydroxy V6/methylphenylbenzotriazole were added to 100 fK of the resin solid content, and dried, resulting in a resin-impregnated base with a resin amount of 43 weight. A laminate consisting of four sheets of the resin-impregnated base material and a copper foil of thickness o and oss fin on the bottom surface was laminated for 1.2 parts at a molding pressure of 50 Kv'd and at 170°C. An electrical laminate was obtained by molding. This electrical laminate was etched to a thickness of 0.015111K V on both sides at the same time.
Cyst (manufactured by Asahi Chemical Laboratory Co., Ltd., DPR-101
1) was applied and dried at 90° C. for 40 minutes, the upper and lower negative films were combined and exposed to light using a metal paralite lamp (manufactured by Oak Manufacturing Co., Ltd.) for 100 minutes. At that time op
yp light Fl ha UV-ts say 0.5ill
ThWld%UV-42 sensor was used for 72m. The uncured portions were dissolved and developed using exposed pyrochloride and heat-cured at 130° C. for 60 minutes using a hot air dryer. Example 2 To the same epoxy resin varnish as in Example 1, 3.0% of nilacer dibutyl disiolybomate was added to 1001 parts of resin solid content.
An electrical laminate was obtained by processing in the same manner as in Example 1, except that 3 g of the resin for laminate was added, and further processed in the same manner as in Example 1. Comparative Example 1 An electrical laminate was obtained by processing in the same manner as in Example 1, except that the same epoxy resin varnish as in Example 1 was used as it was as the resin for the laminate, and further processed in the same manner as in Example 1. Comparative Example 2 The same epoxy resin varnish as in Example 1 was treated in the same manner as in Example 1, except that a resin for laminates was used in which a carbon-based black pigment was added at a rate of 1.51 per 1 y of resin solid content. An electrical laminate was obtained and further treated in the same manner as in Example 1. [Effects of the invention] ゛ ″Example 1
and! As is clear from Table 1, the performance of Comparative Example 1 and Food's electrical laminates when processed into printed wiring boards shows that the performance of the electrical laminates of the present invention was good, and the superiority of the present invention. I confirmed that Note *1 Based on visual inspection. Hata 2 Moisture-resistant insulation resistance using comb-shaped 4-pole, 40℃, 9
After processing for 1000 hours at 5% humidity, the entire surface was covered with solder fusing. One cycle was 3-60°C XaO for 135,330 minutes. Check whether or not cracks occur after 50 cycles of treatment. Procedural amendment (voluntary) Date of December 1999

Claims (3)

[Claims] (1) An electrical laminate characterized by absorbing light with a wavelength of 400-500 mm. (2) The electrical laminate according to claim 1, wherein the amount of the ultraviolet absorber is 0.5 to 3.5 parts by weight based on 100 weight parts of the resin of the electrical laminate. (3) The electrical laminate according to claim 1, wherein the electrical laminate is a glass cloth base laminate.