JPH0369125B2 - - Google Patents
Info
- Publication number
- JPH0369125B2 JPH0369125B2 JP60177079A JP17707985A JPH0369125B2 JP H0369125 B2 JPH0369125 B2 JP H0369125B2 JP 60177079 A JP60177079 A JP 60177079A JP 17707985 A JP17707985 A JP 17707985A JP H0369125 B2 JPH0369125 B2 JP H0369125B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- laminate
- electrical
- laminates
- ultraviolet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000006097 ultraviolet radiation absorber Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 239000007787 solid Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000002966 varnish Substances 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- WSQZNZLOZXSBHA-UHFFFAOYSA-N 3,8-dioxabicyclo[8.2.2]tetradeca-1(12),10,13-triene-2,9-dione Chemical compound O=C1OCCCCOC(=O)C2=CC=C1C=C2 WSQZNZLOZXSBHA-UHFFFAOYSA-N 0.000 description 1
- DQWQLEWWOPBQHX-UHFFFAOYSA-N 5-methyl-4-phenyl-2h-benzotriazole Chemical compound CC1=CC=C2NN=NC2=C1C1=CC=CC=C1 DQWQLEWWOPBQHX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 229920001651 Cyanoacrylate Polymers 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- MWCLLHOVUTZFKS-UHFFFAOYSA-N Methyl cyanoacrylate Chemical compound COC(=O)C(=C)C#N MWCLLHOVUTZFKS-UHFFFAOYSA-N 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- YGSDEFSMJLZEOE-UHFFFAOYSA-M salicylate Chemical compound OC1=CC=CC=C1C([O-])=O YGSDEFSMJLZEOE-UHFFFAOYSA-M 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Insulating Bodies (AREA)
Description
〔技術分野〕
本発明は電気機器、電子機器、計算機器、通信
機器等に用いられる電気用積層板に関するもので
ある。
〔背景技術〕
従来、電気機器等に用いられる電気用積層板を
出発点とするプリント配線板は写真現像型ソルダ
ーレジストを用いているが、紫外線照射時に紫外
線が電気用積層板を透過し裏面迄感光させてしま
い、溶剤による剥離を阻害することが多発してい
た。この対策として紫外線照射量を減少させると
レジストインク本来の耐摩耗性、耐溶剤性、耐湿
性を低下させてしまう。又、逆に紫外線照射量を
適正にし、強制的に機械研磨により残留レジスト
を剥離させると必要レジスト表面をも傷つけた
り、研磨物、溶剤残渣等がプリント配線板表面に
付着して次工程に移り品質不良を発生させてしま
う。更に電気用積層板を黒色にする方法もあるが
黒色化のためにはカーボン系着色剤を添加する必
要があり、フアインパターンには不適で用いられ
なかつた。
〔発明の目的〕
本発明の目的とするところはレジストインクの
裏まわりがなく且つ耐摩耗性、熱衝撃性、耐湿絶
縁抵抗に優れたプリント配線板が得られる電気用
積層板を提供することにある。
〔発明の開示〕
本発明は波長235〜290nm及び400〜500nmの光
を吸収する紫外線吸収剤を含有したことを特徴と
する電気用積層板のため、写真現像型ソルダーレ
ジストを用い紫外線照射することによりレジスト
インキを完全硬化させることができ且つ現像時レ
ジストインキを完全溶解させることができるもの
で、以下本発明を詳細に説明する。
本発明に用いる紫外線吸収剤は、サルチル酸
系、ベンゾフエノン系、ベンゾフエノン系、ベス
ゾトリアゾール系、ヒドロキシベンゾエート系、
シアノアクリレート系等紫外線吸収能力のあるも
ので、波長235〜290nm及び400〜500nmの光を吸
収するものである。更に上記波長における吸収
率、全面エツチング処理状態で235〜290nmでは
75％以上、好ましくは85％以上が望ましく、400
〜500nmでは80％以上、好ましくは90％以上であ
ることが望ましく、そのためには樹脂固形分100
ｇにつき、紫外線吸収剤0.2〜3.5ｇを添加するこ
とが望ましい。電気積層板としては積層板用樹脂
にフエノール樹脂、クレゾール樹脂、エポキシ樹
脂、不飽和ポリエステル樹脂、メラミン樹脂、ポ
リイミド、ポリブタジエン、ポリアミド、ポリア
ミドイミド、ポリフエニレンサルフアイド、ポリ
フエニレンオキサイド、ポリスルフオン、ポリブ
チレンテレフタレート、ポリエーテルエーテルケ
トン、弗化樹脂等の単独、変性物、混合物等が用
いられ必要に応じて粘度調整に水、メチルアルコ
ール、アセトン、シクロヘキサノン、スチレン等
の溶媒を添加したものを用い、積層板用基材とし
ては、ガラス、アスベスト等の無機繊維やポリエ
ステル、ポリアミドド、ポリビニルアルコール、
アクリル等の有機合成繊維や木綿等の天然繊維か
らなる織布、不織布、マツト或は紙又はこれらの
組合せ基材等を用い、積層板用樹脂を積層板用基
材に含浸した樹脂含浸材を所要枚数重ね、更に必
要に応じてその上面及び又は下面に金属箔を配設
した積層体を積層成形し一体化したものである。
紫外線吸収剤は好ましくは積層板用樹脂に添加し
て用いることが望ましいが特に限定するものでは
なく積層板用基材に付着させておくこともできる
ものである。以下本発明を実施例にもとづいて説
明する。
実施例 １
臭素化エポキシ樹脂ワニスに、２・2′ハイドロ
キシ５′メチルフエニルベンゾトリアゾールを樹
脂固型分100ｇに対し２ｇ添加した積層板用樹脂
を、厚さ0.2mmのガラス布に含浸、乾燥して樹脂
量42重量％の樹脂含浸基材を得、該樹脂含浸基材
４枚を重ねた上、下面に厚さ0.035mmの銅箔を
夫々配設した積層体を成形圧力50Kg／cm2、170℃
で120分間積層成形して電気用積層板を得た。こ
の電気用積層板をエツチングし両面同時に厚さ
0.015mmにレジスト（株式会社アサヒ化学研究所
製、DPR−105）を塗布し、90℃で40分間乾燥
後、上、下別々のネガフイルムを合わせ、メタル
ハライドランプ（オーク製作所製）を用い２分間
露光した。その時のランプ照度はUV−25センサ
ーで0.56mw／cm2、UV−42センサーで72mw／cm2
であつた。露光後トリクレンで未硬化部分を溶解
現像処理し熱風乾燥機で130℃、60分間熱硬化さ
せた。
実施例 ２
実施例１と同じ臭素化エポキシ樹脂ワニスに、
ニツケルジブチルジシオカルボメートを樹脂固型
分100ｇに対し１ｇ添加した積層板用樹脂を用い
た以外は実施例１と同様に処理して電気用積層板
を得、更に実施例１と同様に処理した。
比較例 １
実施例１と同じ臭素化エポキシ樹脂ワニスをそ
のまま積層板用樹脂として用いた以外は実施例１
と同様に処理して電気用積層板を得、更に実施例
１と同様に処理した。
比較例 ２
実施例１と同じ臭素化エポキシ樹脂ワニスに、
カーボン系黒色顔料を樹脂固型分100ｇに対し1.5
ｇ添加した積層板用樹脂を用いた以外は実施例１
と同様に処理して電気用積層板を得、更に実施例
１と同様に処理した。
〔発明の効果〕
実施例１と２及び比較例１と２の電気用積層板
をプリント配線板に加工する際の性能は第１表で
明白なように本発明の電気用積層板を用いたもの
の性能はよく、本発明の優れていることを確認し
た。
[Technical Field] The present invention relates to an electrical laminate used in electrical equipment, electronic equipment, computing equipment, communication equipment, etc. [Background technology] Conventionally, printed wiring boards that are made from electrical laminates used in electrical equipment, etc., use photo-developed solder resists, but when irradiated with ultraviolet rays, the ultraviolet light passes through the electrical laminate and reaches the back side. This often resulted in exposure to light, which inhibited peeling with solvents. As a countermeasure to this problem, if the amount of ultraviolet irradiation is reduced, the inherent abrasion resistance, solvent resistance, and moisture resistance of the resist ink will be reduced. On the other hand, if the amount of ultraviolet irradiation is adjusted appropriately and the remaining resist is forcibly removed by mechanical polishing, the necessary resist surface may be damaged, and polishing materials, solvent residues, etc. may adhere to the surface of the printed wiring board, which may be transferred to the next process. This will cause quality defects. Furthermore, there is a method of making electrical laminates black, but this requires the addition of a carbon-based coloring agent, which is unsuitable for fine patterns and has not been used. [Object of the Invention] The object of the present invention is to provide an electrical laminate that does not have a backing of resist ink and can provide a printed wiring board that has excellent abrasion resistance, thermal shock resistance, moisture resistance, and insulation resistance. be. [Disclosure of the Invention] The present invention is an electrical laminate characterized by containing an ultraviolet absorber that absorbs light with wavelengths of 235 to 290 nm and 400 to 500 nm. The present invention will be described in detail below. The ultraviolet absorbers used in the present invention include salicylic acid-based, benzophenone-based, benzophenone-based, beszotriazole-based, hydroxybenzoate-based,
Cyanoacrylate-based materials have ultraviolet absorption ability, and absorb light with wavelengths of 235 to 290 nm and 400 to 500 nm. Furthermore, the absorption rate at the above wavelengths is 235 to 290 nm when the entire surface is etched.
75% or more, preferably 85% or more, 400
At ~500nm, it is desirable that it be 80% or more, preferably 90% or more, and for that purpose, the resin solid content should be 100% or more.
It is desirable to add 0.2 to 3.5 g of ultraviolet absorber per g. For electrical laminates, laminate resins include phenolic resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polyphenylene sulfide, polyphenylene oxide, polysulfon, and polyester resin. Butylene terephthalate, polyether ether ketone, fluorinated resin, etc. alone, modified products, mixtures, etc. are used, and if necessary, a solvent such as water, methyl alcohol, acetone, cyclohexanone, styrene, etc. is added to adjust the viscosity. Base materials for laminates include glass, inorganic fibers such as asbestos, polyester, polyamide, polyvinyl alcohol,
A resin-impregnated material in which the base material for laminates is impregnated with resin for laminates, using woven fabrics, non-woven fabrics, pine, paper, or combinations of these base materials made of organic synthetic fibers such as acrylic, natural fibers such as cotton, etc. The required number of sheets are stacked one on top of the other, and if necessary, metal foil is placed on the top and/or bottom surfaces of the laminate, which is laminated and formed into one piece.
The ultraviolet absorber is preferably added to the resin for the laminate, but is not particularly limited and can be attached to the base material for the laminate. The present invention will be explained below based on examples. Example 1 A glass cloth with a thickness of 0.2 mm was impregnated with a laminate resin made by adding 2 g of 2.2' hydroxy 5' methyl phenyl benzotriazole per 100 g of resin solids to a brominated epoxy resin varnish, and dried. A resin-impregnated base material with a resin content of 42% by weight was obtained, and a laminate in which four sheets of the resin-impregnated base materials were stacked and copper foil with a thickness of 0.035 mm was placed on the bottom surface of each layer was molded at a pressure of 50 kg/cm 2. ,170℃
An electrical laminate was obtained by lamination molding for 120 minutes. This electrical laminate is etched to increase its thickness on both sides at the same time.
Apply a resist (DPR-105, manufactured by Asahi Chemical Laboratory Co., Ltd.) to 0.015 mm, dry at 90℃ for 40 minutes, put together the upper and lower negative films, and heat for 2 minutes using a metal halide lamp (manufactured by Oak Seisakusho). exposed. The lamp illuminance at that time is 0.56mw/cm 2 for the UV-25 sensor and 72mw/cm 2 for the UV-42 sensor.
It was hot. After exposure, the uncured portions were dissolved and developed using trichlene, and heat-cured at 130°C for 60 minutes in a hot air dryer. Example 2 The same brominated epoxy resin varnish as in Example 1 was
An electrical laminate was obtained in the same manner as in Example 1, except that a resin for laminates in which 1 g of nickel dibutyl disiocarbomate was added per 100 g of resin solid content was used, and an electrical laminate was obtained in the same manner as in Example 1. did. Comparative Example 1 Example 1 except that the same brominated epoxy resin varnish as in Example 1 was used as the resin for the laminate.
An electrical laminate was obtained by processing in the same manner as in Example 1, and further processing in the same manner as in Example 1. Comparative Example 2 The same brominated epoxy resin varnish as in Example 1 was
1.5 carbon black pigment per 100g resin solid content
Example 1 except that the laminate resin containing g was used.
An electrical laminate was obtained by processing in the same manner as in Example 1, and further processing in the same manner as in Example 1. [Effects of the Invention] As is clear from Table 1, the performance when processing the electrical laminates of Examples 1 and 2 and Comparative Examples 1 and 2 into printed wiring boards was as follows. The performance was good, confirming the superiority of the present invention.
【表】【table】
Claims (1)
する紫外線吸収剤を含有したことを特徴とする電
気用積層板。1. An electrical laminate containing an ultraviolet absorber that absorbs light with wavelengths of 235 to 290 nm and 400 to 500 nm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60177079A JPS6237822A (en) | 1985-08-12 | 1985-08-12 | Laminate board for electricity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60177079A JPS6237822A (en) | 1985-08-12 | 1985-08-12 | Laminate board for electricity |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6237822A JPS6237822A (en) | 1987-02-18 |
| JPH0369125B2 true JPH0369125B2 (en) | 1991-10-31 |
Family
ID=16024756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60177079A Granted JPS6237822A (en) | 1985-08-12 | 1985-08-12 | Laminate board for electricity |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6237822A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5432769A (en) * | 1977-08-17 | 1979-03-10 | Hitachi Chemical Co Ltd | Method of making print wire board |
| JPS5626156A (en) * | 1979-08-13 | 1981-03-13 | Shigeru Taniguchi | Fluorine-containing chewing gum |
| JPS588596A (en) * | 1981-07-09 | 1983-01-18 | Hitachi Kiden Kogyo Ltd | Panel unit type fermenter |
| JPS61295033A (en) * | 1985-06-24 | 1986-12-25 | 住友ベークライト株式会社 | Manufacture of laminated board for printed circuit |
-
1985
- 1985-08-12 JP JP60177079A patent/JPS6237822A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5432769A (en) * | 1977-08-17 | 1979-03-10 | Hitachi Chemical Co Ltd | Method of making print wire board |
| JPS5626156A (en) * | 1979-08-13 | 1981-03-13 | Shigeru Taniguchi | Fluorine-containing chewing gum |
| JPS588596A (en) * | 1981-07-09 | 1983-01-18 | Hitachi Kiden Kogyo Ltd | Panel unit type fermenter |
| JPS61295033A (en) * | 1985-06-24 | 1986-12-25 | 住友ベークライト株式会社 | Manufacture of laminated board for printed circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6237822A (en) | 1987-02-18 |
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