JPS6237822A - Laminate board for electricity - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an electrical laminate used in electrical equipment, electronic equipment, computing equipment, communication equipment, etc.

[Background technology]

Conventionally, printed wiring boards that originate from electrical laminates used in electrical equipment use photo-developable solder resists, but when irradiated with ultraviolet light, the ultraviolet light passes through the electrical laminate and exposes the back side. This often resulted in problems with removal using solvents. As a countermeasure to this problem, if the amount of ultraviolet irradiation is reduced, the inherent abrasion resistance, solvent resistance, and moisture resistance of the resist ink will be reduced. On the other hand, if the amount of ultraviolet irradiation is excessive and the remaining resist is forcibly removed by mechanical polishing, the necessary resist surface may be damaged, and polishing materials, solvent residues, etc. may adhere to the surface of the printed wiring board, causing it to be transferred to the next process. This will cause quality defects.

Furthermore, there is a method of making electrical laminates black, but this requires the addition of a carbon thread coloring agent, which is unsuitable for fine patterns and has not been used.

[Purpose of the invention]

An object of the present invention is to provide an electrical laminate that does not cause backing of resist ink and provides a printed wiring board with excellent abrasion resistance, thermal shock resistance, moisture resistance, and insulation resistance.

[Disclosure of the invention]

The present invention is an electrical laminate characterized in that it contains an ultraviolet absorber, so that by irradiating it with ultraviolet light using a photo-developable solder resist, l) v resist ink can be completely cured, and the resist ink can be completely cured during development. The present invention will be described in detail below.

The ultraviolet absorbers used in the present invention include salicylic acid type, benzophenone thread, benzophenone thread, beszotriazo-i'
M, hydroxybenzoate yarn, phosphorus acrylate yarn, etc. are not particularly limited as long as they have the ability to absorb ultraviolet rays, but the wavelength is preferably 235 to 290 l.
It is desirable that it handles light of 400 to 500 IIjI. Furthermore, the absorption rate at the above wavelength is
For 235 to 29ON, it is desirably 75% or more, preferably 85% or more, and for 400 to 5007g, it is desirable to be 80% or more, preferably 90% or more, and for this purpose, the ultraviolet absorber is 0.5% per 1002 of resin solid content. ~3
．． It is desirable to add 52. For electrical laminates, phenol resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polyphenylene sulfide, polyphenylene oxide, polysulfone, polyethylene terephthalate, polyphenylene terephthalate, Ether ether/L/rton, fluoride resin, etc. alone, modified products, mixtures, etc. are used, and if necessary, water, methyl alcohol, acetone, cyclohexanone, styrene, etc. are added to adjust the viscosity, and laminated. The base material for the board may be woven fabric, non-woven fabric, mat or paper made of inorganic fibers such as Gawon, asbestos, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, acrylic, natural fibers such as cotton, or a combination thereof. The required number of resin-impregnated base materials, which are made by impregnating the laminate base material with resin for laminates, are stacked one on top of the other, and if necessary, metal foil is placed on the upper and/or lower surfaces of the resin-impregnated base materials to form a laminate. It is integrated. The ultraviolet absorber is preferably used by adding it to the resin for the laminate, but it is not particularly limited and can be attached to the base material for the laminate. explain.

Example 1 2.2'Hydroquine 5'Methylphenylbenzotriazole was added to brominated Evoki V resin Waninu in a resin solid content of 1
2f for 002! The added resin for laminates was added to a thickness of 0.
A glass cloth of No. 28 was impregnated and dried to obtain a resin-impregnated base material with a resin loading weight of %.Four sheets of the resin-impregnated base material were stacked, and a copper foil with a thickness of 0.035 ttai was placed on the bottom surface of each. The resulting laminate was laminated for 120 minutes at a molding pressure of 50 Wag and lro'C to obtain an electrical laminate. This electrical laminate was etched and a resist (manufactured by Asahi Chemical Laboratory Co., Ltd., DPR-106) was applied to both sides at the same time to a thickness of 0.015 M. After drying at 90'C for lead, the top and bottom were separated into negatives. The films were combined and exposed for 4 minutes using a metal halide lamp (Oak Manufacturing Co., Ltd.).

The lamp illuminance at that time was 0.56 mw/
, J, 72mw with UV-g sensor, ivy with E. After exposure, the uncured portions were dissolved and developed using trichlene and thermally cured at 130° C. for 0 minutes in a hot air dryer.

Example 2 Nigge A was added to the same brominated epoxy V resin varnish as in Example 1.
Example 1 except that a resin for laminates in which lp of dibutyl diV ocarbomate was added to the resin solid content toop was used.
An electrical laminate was obtained by processing in the same manner as in Example 1, and further processing in the same manner as in Example 1.

Comparative Example 1 An electrical laminate was obtained in the same manner as in Example 1, except that the same brominated epoxy resin varnish as in Example 1 was used as the resin for the laminate, and further treated in the same manner as in Example 1.

Comparative Example 2 To the same brominated epoxy resin varnish as in Example 1, a carbon-based black pigment was added in an amount of 1. An electrical laminate was obtained by processing in the same manner as in Example 1, except that a resin for laminates containing fi1 was used, and was further processed in the same manner as in Example 1.

〔Effect of the invention〕

As is clear from Table 1, the performance of the electrical and electrical laminates of Examples 1 and 2 and Comparative Examples 1 and 2 when processed into printed wiring boards was good. The superiority of the present invention was confirmed.

Chapter 1 Table note *l By visual inspection.

*2 Moisture-resistant insulation resistance using comb-shaped electrodes, 40"09
After processing for 1000 hours at 5% humidity, the entire surface was covered with solder resist.

One cycle is 13-60°C x 2 minutes and 135°C x I minutes, and the presence or absence of cracks after the ω cycle treatment is checked.

Procedural amendment (decorative pot) Showa tρ/λ month 7th

Claims (2)

[Claims] (1) An electrical laminate characterized by containing an ultraviolet absorber. (2) The ultraviolet absorber has wavelengths of 235 to 290 mm and 4
The electrical laminate according to claim 1, which absorbs light with a wavelength of 00 to 500 mm.