JPS62132390A - Electric laminate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an electrical laminate used for industrial equipment, child equipment, computing equipment, communication equipment, and the like.

[Background technology]

Conventionally,! Printed wiring boards, which are made from electrical laminates used in electrical equipment, use photo-developed solder resists, but when irradiated with ultraviolet light, the ultraviolet light passes through the electrical laminates and exposes the back side. There were many cases in which peeling was inhibited by As a countermeasure to this problem, if the amount of ultraviolet irradiation is reduced, the inherent abrasion resistance, solvent resistance, and moisture resistance of the resist ink will be reduced. In addition, if the amount of ultraviolet irradiation is adjusted appropriately and the residual resist is forcibly removed by mechanical polishing, the necessary resist surface may be damaged, and polishing materials, solvent residues, etc. may adhere to the printed wiring board surface and transfer to the next process. This will cause quality defects. Furthermore, there is a method of making electrical laminates black, but this method requires the addition of a carbon-based coloring agent and is not suitable for fine patterns, so it has not been used.

[Purpose of the invention]

An object of the present invention is to provide an electrical laminate that does not cause backing of resist ink and provides a printed wiring board with excellent abrasion resistance, thermal shock resistance, moisture resistance, and insulation resistance.

[Disclosure of the invention]

The present invention is an electrical laminate characterized in that it contains ultraviolet absorbing Iil, so that resist ink can be completely cured by irradiating ultraviolet light using a photo-developable solder resin, and the resist ink can be completely cured during development. This invention can be completely dissolved, and the present invention will be described in detail below.

The ultraviolet absorber used in the present invention has a wavelength of 300 to 400 nm.
Salicylic acid type, benzophenone type, which absorbs light of m
Peszotriazo N-based, hydroxybenzoate yarn, cyanoacrylate-based ultraviolet absorption, preferably wavelength 300~
4QQ fim light of 97% or more, more preferably 99%
% or more is desirable. For this purpose, 0.2 to 3 UV absorbers should be added per 100 parts of resin solid content.
．． It is desirable to add 57. 'F! ! For air laminates, resins for laminates include 7 enol resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polygetadiene, polyamide, polyamideimide, polyphenylene sulfide, polyphenylene oxide, polysulfone, polybutylene terephthalate. , polyetheretherketone, fluorinated resin, etc. alone, modified products, mixtures, etc. are used, and if necessary, a bath additive such as water, methane, acetone, cyclohexanone, styrene, etc. is added to adjust the viscosity. The base material for the laminate is glass, non-iH1 fiber such as Aspect, polyester, polyamide, polyvinyl alcohol,
Resin-impregnated base material made of organic synthetic fibers such as acrylic resin, natural fibers such as cotton, woven fabrics, non-woven fabrics, mats, paper, or combinations thereof, and impregnated with resin for laminates into the base material for laminates. A laminate is formed by laminating and molding a laminate in which a required number of materials are stacked, and if necessary, metal foil is placed on the upper and/or lower surfaces of the laminate. The ultraviolet absorber is preferably added to the resin for the laminate, but is not particularly limited and can be attached to the base material for the laminate.

The present invention will be explained below based on examples.

Example 1 2.(2'Hydroxy3'T-Gucci/115'Methylphenyl).5 on a brominated epoxy resin face
Add chlorobenzotriazole to the resin solids content.

Laminate resin with 27 added to 1:1 to a thickness of 0.2 TI
A glass cloth of N was impregnated and dried to obtain a resin-impregnated base material with a resin amount of aZ violet% (hereinafter simply referred to as %).Four sheets of the resin-impregnated base material were stacked and a layer of 0.035 mm thick was placed on the bottom surface. The laminate with each copper foil was molded at a pressure of 5Q Q/, and at 170°C.
The flI laminate was obtained by lamination for 20 minutes.

This electrical laminate is etched to a thickness of 0.0 on both sides at the same time.
15121 resist (Asa to Kagaku Kenkyushin Co., Ltd.,
After applying DPR-1057 and drying at 90℃ for a few minutes,
The upper and lower negative films were combined and exposed for 2 minutes using a metal halide lamp (manufactured by Oak Seisakusho). The lamp illumination at that time is 27.5mW with a UV-35 sensor.
/J. After exposure, the uncured portions were dissolved and developed using trichlene and thermally cured at 130° C. for 1 Ω in a hot air dryer.

Example 2 2-hydroxy-4-methoxybenzophenone was added to the same brominated epoxy resin face as in Example 1 at a solid content of 10 tWO.
1 for 0v. S? I added m! An electrical laminate was obtained by processing in the same manner as in Example 1 except that the board-grade resin was used.
Further treatment was carried out in the same manner as in Example 1.

Example 3 Nickel was added to the same brominated epoxy resin varnish as in Example 1.
An electrical laminate was obtained in the same manner as in Example 1, except that a resin for laminates in which 1.51 i of Dipty dithiocabomate was added per 100 F of resin solid content was used, and an electrical laminate was obtained in the same manner as in Example 1. processed.

Comparative Example 1 The same brominated epoxy resin varnish as in Example 1 was used as is.
A laminate was obtained by processing in the same manner as in Example 1 except that it was used as a resin for a laminate, and was further processed in the same manner as in Example 1.

Comparative Example 2 The same brominated epoxy resin face as in Example 1 was treated in the same manner as in Example 1, except that a resin for laminates in which carbon-based black pigment was added at 1.52% per 1ooS' of resin solid content was used. An electrical laminate was obtained and further treated in the same manner as in Example 1.

〔Effect of the invention〕

As is clear from Table 1, the performance of the electrical laminated boards of Examples 1 to 3 and Comparative Examples 1 and 2 when processed into printed wiring boards was good. The superiority of the present invention was confirmed.

Chapter 1 Table note $1 By visual inspection.

Spicy 2 Moisture-resistant insulation resistance using interdigitated electrodes, ω°C95
% humidity, and after processing for 1000 hours, the entire surface was covered with solder resin.

Claims (2)

[Claims] (1) An electrical laminate characterized by containing an ultraviolet absorber that absorbs light with a wavelength of 300 to 400 nm. (2) Ultraviolet absorber absorbs light with a wavelength of 300 to 400 nm.
The electrical laminate according to claim 1, wherein the electrical laminate absorbs 7% or more.