JPS6236797B2 - - Google Patents
Info
- Publication number
- JPS6236797B2 JPS6236797B2 JP6799579A JP6799579A JPS6236797B2 JP S6236797 B2 JPS6236797 B2 JP S6236797B2 JP 6799579 A JP6799579 A JP 6799579A JP 6799579 A JP6799579 A JP 6799579A JP S6236797 B2 JPS6236797 B2 JP S6236797B2
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- weight
- alloy
- grooves
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6799579A JPS55158895A (en) | 1979-05-31 | 1979-05-31 | Silver solder alloy |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6799579A JPS55158895A (en) | 1979-05-31 | 1979-05-31 | Silver solder alloy |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55158895A JPS55158895A (en) | 1980-12-10 |
JPS6236797B2 true JPS6236797B2 (enrdf_load_stackoverflow) | 1987-08-08 |
Family
ID=13361049
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6799579A Granted JPS55158895A (en) | 1979-05-31 | 1979-05-31 | Silver solder alloy |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55158895A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105177342B (zh) * | 2015-09-24 | 2017-05-31 | 无锡日月合金材料有限公司 | 一种三元合金封接材料的制备方法 |
JP2019076939A (ja) * | 2017-10-26 | 2019-05-23 | 京セラ株式会社 | ろう材、接合構造および半導体パッケージ |
-
1979
- 1979-05-31 JP JP6799579A patent/JPS55158895A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS55158895A (en) | 1980-12-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS6236797B2 (enrdf_load_stackoverflow) | ||
JP2681742B2 (ja) | 無鉛はんだ合金 | |
JPH081373A (ja) | Sn基低融点ろう材 | |
WO1982000790A1 (en) | Low-silver cu-ag alloy solder having good soldering properties and low vapor pressure | |
JPS6272496A (ja) | はんだ合金 | |
JPS63317289A (ja) | 銀ろう合金 | |
JPS6218276B2 (enrdf_load_stackoverflow) | ||
JPS6236798B2 (enrdf_load_stackoverflow) | ||
JPS63317276A (ja) | 金ろう合金 | |
KR100320545B1 (ko) | Sn계저융점땜납재 | |
JPS6111158B2 (enrdf_load_stackoverflow) | ||
JPS63317293A (ja) | パラジウムろう合金 | |
JPS63317277A (ja) | 金ろう合金 | |
JPS6216753B2 (enrdf_load_stackoverflow) | ||
JPH06297186A (ja) | Sn基低融点ろう材 | |
JPS63317287A (ja) | 銀ろう合金 | |
JPS63313690A (ja) | 金ろう合金 | |
JPS63317273A (ja) | 金ろう合金 | |
JPS63313693A (ja) | 銀ろう合金 | |
JPS63317279A (ja) | 金ろう合金 | |
JPS63317294A (ja) | パラジウムろう合金 | |
JPS63317290A (ja) | 銀ろう合金 | |
JPH0450112B2 (enrdf_load_stackoverflow) | ||
JPS63313696A (ja) | パラジウムろう合金 | |
JPS63317291A (ja) | 銀ろう合金 |