JPS55158895A - Silver solder alloy - Google Patents

Silver solder alloy

Info

Publication number
JPS55158895A
JPS55158895A JP6799579A JP6799579A JPS55158895A JP S55158895 A JPS55158895 A JP S55158895A JP 6799579 A JP6799579 A JP 6799579A JP 6799579 A JP6799579 A JP 6799579A JP S55158895 A JPS55158895 A JP S55158895A
Authority
JP
Japan
Prior art keywords
brazing
silver solder
solder alloy
alloy
flux
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6799579A
Other languages
Japanese (ja)
Other versions
JPS6236797B2 (en
Inventor
Kozo Kashiwagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Kikinzoku Kogyo KK
Original Assignee
Tanaka Kikinzoku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Kikinzoku Kogyo KK filed Critical Tanaka Kikinzoku Kogyo KK
Priority to JP6799579A priority Critical patent/JPS55158895A/en
Publication of JPS55158895A publication Critical patent/JPS55158895A/en
Publication of JPS6236797B2 publication Critical patent/JPS6236797B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
    • B23K35/3006—Ag as the principal constituent

Abstract

PURPOSE:To obtain a silver solder alloy permitting brazing without use of flux, causing only small roughness of brazed surface, and free from corrosion and other defects after pickling. for use in vacuum or N2 atmosphere, by adding a specified amount of Sn or In to Ag-Cu eutectic alloy. CONSTITUTION:The feature of this silver solder alloy is addition one kind of Sn or In by 0.05-2wt% to the conventional Ag-Cu alloy. This brazing filler metal, as compared with others, permits brazing in vacuum or nitrogen atmosphere without use of flux, and does not cause the metal to evaporate while brazing, produces only small roughness on the brazed surface and hardly causes grooves. Therefore, pickling solution or the like is not left over, which, as a result, restricts discoloration and corrosion.
JP6799579A 1979-05-31 1979-05-31 Silver solder alloy Granted JPS55158895A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6799579A JPS55158895A (en) 1979-05-31 1979-05-31 Silver solder alloy

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6799579A JPS55158895A (en) 1979-05-31 1979-05-31 Silver solder alloy

Publications (2)

Publication Number Publication Date
JPS55158895A true JPS55158895A (en) 1980-12-10
JPS6236797B2 JPS6236797B2 (en) 1987-08-08

Family

ID=13361049

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6799579A Granted JPS55158895A (en) 1979-05-31 1979-05-31 Silver solder alloy

Country Status (1)

Country Link
JP (1) JPS55158895A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105177342A (en) * 2015-09-24 2015-12-23 无锡日月合金材料有限公司 Preparation method of ternary alloy sealing material
JP2019076939A (en) * 2017-10-26 2019-05-23 京セラ株式会社 Brazing material, junction structure, and semiconductor package

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63272380A (en) * 1987-04-30 1988-11-09 株式会社エポツク社 Controller for racing toy

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105177342A (en) * 2015-09-24 2015-12-23 无锡日月合金材料有限公司 Preparation method of ternary alloy sealing material
JP2019076939A (en) * 2017-10-26 2019-05-23 京セラ株式会社 Brazing material, junction structure, and semiconductor package

Also Published As

Publication number Publication date
JPS6236797B2 (en) 1987-08-08

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