JPS6236299Y2 - - Google Patents

Info

Publication number
JPS6236299Y2
JPS6236299Y2 JP9198482U JP9198482U JPS6236299Y2 JP S6236299 Y2 JPS6236299 Y2 JP S6236299Y2 JP 9198482 U JP9198482 U JP 9198482U JP 9198482 U JP9198482 U JP 9198482U JP S6236299 Y2 JPS6236299 Y2 JP S6236299Y2
Authority
JP
Japan
Prior art keywords
lead frame
outer frame
semiconductor
insulating part
pellet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9198482U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58193642U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9198482U priority Critical patent/JPS58193642U/ja
Publication of JPS58193642U publication Critical patent/JPS58193642U/ja
Application granted granted Critical
Publication of JPS6236299Y2 publication Critical patent/JPS6236299Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP9198482U 1982-06-18 1982-06-18 リ−ドフレ−ム Granted JPS58193642U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9198482U JPS58193642U (ja) 1982-06-18 1982-06-18 リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9198482U JPS58193642U (ja) 1982-06-18 1982-06-18 リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS58193642U JPS58193642U (ja) 1983-12-23
JPS6236299Y2 true JPS6236299Y2 (de) 1987-09-16

Family

ID=30100202

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9198482U Granted JPS58193642U (ja) 1982-06-18 1982-06-18 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS58193642U (de)

Also Published As

Publication number Publication date
JPS58193642U (ja) 1983-12-23

Similar Documents

Publication Publication Date Title
US6175149B1 (en) Mounting multiple semiconductor dies in a package
KR100294719B1 (ko) 수지밀봉형 반도체장치 및 그 제조방법, 리드프레임
US6297547B1 (en) Mounting multiple semiconductor dies in a package
JPH07123149B2 (ja) 半導体パッケージ
JP2000243887A (ja) 半導体装置とその製造方法
JPH10256470A (ja) 半導体装置
US5006919A (en) Integrated circuit package
JP2001035961A (ja) 半導体装置及びその製造方法
JPH01196153A (ja) 樹脂封止半導体装置
JPS6236299Y2 (de)
JP2000243880A (ja) 半導体装置とその製造方法
JPH0567697A (ja) 樹脂封止型半導体装置
JPS63146453A (ja) 半導体パツケ−ジおよびその製造方法
JP2954108B2 (ja) 半導体装置およびその製造方法
JP2875591B2 (ja) 半導体装置及びその製造方法
JP2001177007A (ja) 半導体装置及びその製造方法
JPH0834281B2 (ja) 半導体装置
JP2503029B2 (ja) 薄型構造の半導体装置の製造方法
JP3867881B2 (ja) 半導体装置
JP4207671B2 (ja) 半導体パッケージの製造方法
JPH08316361A (ja) 半導体装置
JP2726555B2 (ja) 樹脂封止型半導体装置
JPH07249708A (ja) 半導体装置及びその実装構造
JPH08250624A (ja) 半導体装置およびその製造方法
JPS63107126A (ja) 半導体装置