JPS6236050B2 - - Google Patents
Info
- Publication number
- JPS6236050B2 JPS6236050B2 JP58047200A JP4720083A JPS6236050B2 JP S6236050 B2 JPS6236050 B2 JP S6236050B2 JP 58047200 A JP58047200 A JP 58047200A JP 4720083 A JP4720083 A JP 4720083A JP S6236050 B2 JPS6236050 B2 JP S6236050B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- epoxy resin
- molding
- mold release
- silicone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4720083A JPS59172541A (ja) | 1983-03-23 | 1983-03-23 | エポキシ樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4720083A JPS59172541A (ja) | 1983-03-23 | 1983-03-23 | エポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59172541A JPS59172541A (ja) | 1984-09-29 |
| JPS6236050B2 true JPS6236050B2 (cs) | 1987-08-05 |
Family
ID=12768486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4720083A Granted JPS59172541A (ja) | 1983-03-23 | 1983-03-23 | エポキシ樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59172541A (cs) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0735432B2 (ja) * | 1984-09-29 | 1995-04-19 | 日東電工株式会社 | 半導体封止用エポキシ樹脂組成物の製造方法 |
| JPH0717739B2 (ja) * | 1985-10-28 | 1995-03-01 | 日東電工株式会社 | 半導体装置 |
| JPS644612A (en) * | 1987-06-25 | 1989-01-09 | Matsushita Electric Works Ltd | Preparation of phenol resin |
| JP2506220B2 (ja) * | 1990-06-19 | 1996-06-12 | 日東電工株式会社 | 半導体装置 |
| JP2655833B2 (ja) * | 1996-03-11 | 1997-09-24 | 日東電工株式会社 | 半導体装置 |
| JP2690884B2 (ja) * | 1996-04-22 | 1997-12-17 | 日東電工株式会社 | 半導体封止用エポキシ樹脂組成物の製造方法 |
| FR2793493B1 (fr) * | 1999-04-28 | 2001-07-20 | Aerospatiale Airbus | Procede de protection contre la corrosion par les produits chimiques de membranes souples en silicone auto-demoulant |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4022753A (en) * | 1974-03-25 | 1977-05-10 | Ciba-Geigy Corporation | Reaction products of polysiloxanes and polyphenols |
| JPS5158458A (ja) * | 1974-11-18 | 1976-05-21 | Shinetsu Chemical Co | Shirikoonjushisoseibutsu |
| JPS5723625A (en) * | 1980-07-17 | 1982-02-06 | Toshiba Corp | Epoxy resin composition and resin-sealed semiconductor device |
| JPS5821417A (ja) * | 1981-07-29 | 1983-02-08 | Shin Etsu Chem Co Ltd | 硬化性エポキシ樹脂組成物 |
| JPS5918724A (ja) * | 1982-07-23 | 1984-01-31 | Nitto Electric Ind Co Ltd | 熱硬化性樹脂組成物 |
-
1983
- 1983-03-23 JP JP4720083A patent/JPS59172541A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59172541A (ja) | 1984-09-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5516858A (en) | Epoxy group-containing silicone resin and compositions based thereon | |
| US5952439A (en) | Epoxy group-containing silicone resin and compositions based thereon | |
| US6491845B1 (en) | Epoxy hardener of phenolic or 2° OH polyol and methylol polyol | |
| JPS6236050B2 (cs) | ||
| SG185028A1 (en) | Phosphazene blocked azole compounds as latent catalysts for epoxy resins | |
| JPS60206824A (ja) | 半導体封止用エポキシ樹脂組成物 | |
| JP3043838B2 (ja) | シリコーン系ブロック共重合体および成形用エポキシ樹脂組成物 | |
| JPS608315A (ja) | 半導体封止用エポキシ樹脂成形材料 | |
| KR930004249B1 (ko) | 수지 봉지형 반도체장치 | |
| JPS6332807B2 (cs) | ||
| JPH0377211B2 (cs) | ||
| JPS5918724A (ja) | 熱硬化性樹脂組成物 | |
| JPH07309998A (ja) | 金型表面離型処理用樹脂組成物及び該組成物を用いた金型表面の離型処理法並びに該組成物で離型処理した金型を用いた熱硬化性樹脂成形品の成形方法 | |
| JPS6069129A (ja) | エポキシ樹脂組成物 | |
| JP2001106771A (ja) | エポキシ樹脂成形材料 | |
| JP3602619B2 (ja) | 新規な変性オルガノポリシロキサン化合物およびそれを用いた半導体封止用エポキシ樹脂組成物 | |
| JP2987180B2 (ja) | 硬化性エポキシ樹脂組成物 | |
| KR900000421B1 (ko) | 반도체 봉지용 에폭시수지 조성물 | |
| JP2002037983A (ja) | エポキシ樹脂組成物 | |
| JPH03167215A (ja) | 樹脂組成物 | |
| KR940004856B1 (ko) | 반도체 봉지용 에폭시 수지 조성물 | |
| JP2010189296A (ja) | フェノール誘導型化合物、その製造方法、及びその用途 | |
| JPH02187416A (ja) | ノボラック樹脂含有組成物 | |
| KR900000422B1 (ko) | 반도체 봉지용 에폭시수지 조성물 | |
| JPS59113014A (ja) | 離型性樹脂及び離型性樹脂組成物 |