JPS6235876B2 - - Google Patents

Info

Publication number
JPS6235876B2
JPS6235876B2 JP55087627A JP8762780A JPS6235876B2 JP S6235876 B2 JPS6235876 B2 JP S6235876B2 JP 55087627 A JP55087627 A JP 55087627A JP 8762780 A JP8762780 A JP 8762780A JP S6235876 B2 JPS6235876 B2 JP S6235876B2
Authority
JP
Japan
Prior art keywords
aluminum
solder
melting point
present
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55087627A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5711793A (en
Inventor
Isataka Araki
Kenji Sato
Michio Hirose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Cable Industries Ltd
Original Assignee
Mitsubishi Cable Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Cable Industries Ltd filed Critical Mitsubishi Cable Industries Ltd
Priority to JP8762780A priority Critical patent/JPS5711793A/ja
Publication of JPS5711793A publication Critical patent/JPS5711793A/ja
Publication of JPS6235876B2 publication Critical patent/JPS6235876B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Coating With Molten Metal (AREA)
JP8762780A 1980-06-26 1980-06-26 Solder for aluminium Granted JPS5711793A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8762780A JPS5711793A (en) 1980-06-26 1980-06-26 Solder for aluminium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8762780A JPS5711793A (en) 1980-06-26 1980-06-26 Solder for aluminium

Publications (2)

Publication Number Publication Date
JPS5711793A JPS5711793A (en) 1982-01-21
JPS6235876B2 true JPS6235876B2 (enrdf_load_stackoverflow) 1987-08-04

Family

ID=13920209

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8762780A Granted JPS5711793A (en) 1980-06-26 1980-06-26 Solder for aluminium

Country Status (1)

Country Link
JP (1) JPS5711793A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06219089A (ja) * 1993-02-15 1994-08-09 Hiroshi Sano 紙挟み装置
WO2002034969A1 (fr) * 2000-10-24 2002-05-02 Fujitsu Limited Alliage destine au brasage tendre et a des joints a brasure tendre

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189096A (ja) * 1983-04-08 1984-10-26 Senjiyu Kinzoku Kogyo Kk 半田合金
JP3232963B2 (ja) * 1994-10-11 2001-11-26 株式会社日立製作所 有機基板接続用鉛レスはんだ及びそれを用いた実装品
US6503338B1 (en) 2000-04-28 2003-01-07 Senju Metal Industry Co., Ltd. Lead-free solder alloys
JP4877890B2 (ja) * 2001-06-18 2012-02-15 株式会社東京自働機械製作所 物品供給装置
JP2003234433A (ja) 2001-10-01 2003-08-22 Matsushita Electric Ind Co Ltd 半導体装置、半導体装置の実装方法、ならびに実装体およびその製造方法
CN100453246C (zh) * 2006-07-13 2009-01-21 昆山成利焊锡制造有限公司 无铅软钎焊料
CN102152022A (zh) * 2011-04-18 2011-08-17 宁波喜汉锡焊料有限公司 一种高抗氧耐蚀SnZn基无铅钎料

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5255927U (enrdf_load_stackoverflow) * 1975-10-13 1977-04-22

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06219089A (ja) * 1993-02-15 1994-08-09 Hiroshi Sano 紙挟み装置
WO2002034969A1 (fr) * 2000-10-24 2002-05-02 Fujitsu Limited Alliage destine au brasage tendre et a des joints a brasure tendre

Also Published As

Publication number Publication date
JPS5711793A (en) 1982-01-21

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