JPS623578B2 - - Google Patents
Info
- Publication number
- JPS623578B2 JPS623578B2 JP58156260A JP15626083A JPS623578B2 JP S623578 B2 JPS623578 B2 JP S623578B2 JP 58156260 A JP58156260 A JP 58156260A JP 15626083 A JP15626083 A JP 15626083A JP S623578 B2 JPS623578 B2 JP S623578B2
- Authority
- JP
- Japan
- Prior art keywords
- pattern
- patterns
- partial
- standard
- detecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10162—Shape being a cuboid with a square active surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Image Processing (AREA)
- Image Analysis (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58156260A JPS5981769A (ja) | 1983-08-29 | 1983-08-29 | 位置検出装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58156260A JPS5981769A (ja) | 1983-08-29 | 1983-08-29 | 位置検出装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5651976A Division JPS52140278A (en) | 1976-05-19 | 1976-05-19 | Position detector |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5981769A JPS5981769A (ja) | 1984-05-11 |
JPS623578B2 true JPS623578B2 (enrdf_load_stackoverflow) | 1987-01-26 |
Family
ID=15623906
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58156260A Granted JPS5981769A (ja) | 1983-08-29 | 1983-08-29 | 位置検出装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5981769A (enrdf_load_stackoverflow) |
-
1983
- 1983-08-29 JP JP58156260A patent/JPS5981769A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5981769A (ja) | 1984-05-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4450579A (en) | Recognition method and apparatus | |
JPH07111998B2 (ja) | ワイヤボンディング検査装置 | |
JP2851151B2 (ja) | ワイヤボンディング検査装置 | |
JP3235008B2 (ja) | ワイヤボンデイング部のボール検出方法及び検出装置 | |
JPS6223457B2 (enrdf_load_stackoverflow) | ||
JPS623578B2 (enrdf_load_stackoverflow) | ||
JP2018152375A (ja) | ダイボンディング装置および半導体装置の製造方法 | |
JPS6223456B2 (enrdf_load_stackoverflow) | ||
US6510240B1 (en) | Automatic detection of die absence on the wire bonding machine | |
JP3822923B2 (ja) | ピックアップ装置及びチップ位置決め方法 | |
JPS60227431A (ja) | ダイボンデイング状態の検査装置 | |
KR100261605B1 (ko) | 칩 마운터용 고정도 화상 입력장치 | |
JPH0770551B2 (ja) | 半導体チツプのダイボンデイング位置確認方法 | |
JP2850641B2 (ja) | 半導体装置の製造方法および製造装置 | |
JPH04315905A (ja) | 物体検査装置 | |
GB1592368A (en) | Automated manipulative operation system | |
KR100422277B1 (ko) | 화상처리방법 및 장치 | |
JPS6412091B2 (enrdf_load_stackoverflow) | ||
JPS5867033A (ja) | ワイヤボンデイング方法 | |
KR20000001920A (ko) | 본딩와이어 검사장치 및 그 검사방법 | |
JPH06102024A (ja) | ワイヤ検査装置及び検査方法 | |
JP2966045B2 (ja) | 加工装置のための動作量補正方法及び装置 | |
JP3006437B2 (ja) | 電子部品観察装置及び電子部品観察方法 | |
KR19990010136A (ko) | 패턴 인식 장치 및 이를 이용한 그라운드 본딩 위치 인식방법 | |
JPH0732188B2 (ja) | 半導体装置の検査装置 |