JPS6223456B2 - - Google Patents

Info

Publication number
JPS6223456B2
JPS6223456B2 JP58156257A JP15625783A JPS6223456B2 JP S6223456 B2 JPS6223456 B2 JP S6223456B2 JP 58156257 A JP58156257 A JP 58156257A JP 15625783 A JP15625783 A JP 15625783A JP S6223456 B2 JPS6223456 B2 JP S6223456B2
Authority
JP
Japan
Prior art keywords
pellet
image
pads
pad
imaging
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58156257A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5990162A (ja
Inventor
Michihiro Mese
Seiji Kashioka
Masakazu Ejiri
Takafumi Myatake
Isamu Yamazaki
Toshimitsu Hamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58156257A priority Critical patent/JPS5990162A/ja
Publication of JPS5990162A publication Critical patent/JPS5990162A/ja
Publication of JPS6223456B2 publication Critical patent/JPS6223456B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/60Analysis of geometric attributes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Image Processing (AREA)
  • Wire Bonding (AREA)
  • Image Analysis (AREA)
JP58156257A 1983-08-29 1983-08-29 位置検出装置 Granted JPS5990162A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58156257A JPS5990162A (ja) 1983-08-29 1983-08-29 位置検出装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58156257A JPS5990162A (ja) 1983-08-29 1983-08-29 位置検出装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP5651976A Division JPS52140278A (en) 1976-05-19 1976-05-19 Position detector

Publications (2)

Publication Number Publication Date
JPS5990162A JPS5990162A (ja) 1984-05-24
JPS6223456B2 true JPS6223456B2 (enrdf_load_stackoverflow) 1987-05-22

Family

ID=15623837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58156257A Granted JPS5990162A (ja) 1983-08-29 1983-08-29 位置検出装置

Country Status (1)

Country Link
JP (1) JPS5990162A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5199084A (en) * 1991-08-16 1993-03-30 International Business Machines Corporation Apparatus and method for locating characters on a label

Also Published As

Publication number Publication date
JPS5990162A (ja) 1984-05-24

Similar Documents

Publication Publication Date Title
EP0041870B1 (en) Pattern position recognition apparatus
EP0657917A1 (en) Wire bonding apparatus
EP0823037A1 (en) Method and system for triangulation-based, 3-d imaging utilizing an angled scanning beam of radiant energy
JP2002529907A (ja) 改良された画像形成システムを備えた電子回路組立装置
JP2851151B2 (ja) ワイヤボンディング検査装置
CN113380661A (zh) 芯片贴装装置及半导体器件的制造方法
JPS6223456B2 (enrdf_load_stackoverflow)
JPS6223457B2 (enrdf_load_stackoverflow)
JP2018152375A (ja) ダイボンディング装置および半導体装置の製造方法
JPS623578B2 (enrdf_load_stackoverflow)
US6510240B1 (en) Automatic detection of die absence on the wire bonding machine
JPH10132524A (ja) 基板検査装置
JP7561070B2 (ja) ダイボンディング装置および半導体装置の製造方法
TWI786739B (zh) 晶粒接合裝置及半導體裝置之製造方法
JP7714414B2 (ja) ダイボンディング装置および半導体装置の製造方法
JPH04315905A (ja) 物体検査装置
KR100231274B1 (ko) 패턴 인식 장치 및 이를 이용한 그라운드 본딩 위치 인식 방법
GB1592368A (en) Automated manipulative operation system
JPH06102024A (ja) ワイヤ検査装置及び検査方法
JP2644263B2 (ja) 位置認識装置
KR100422277B1 (ko) 화상처리방법 및 장치
JPH0732188B2 (ja) 半導体装置の検査装置
JP3006437B2 (ja) 電子部品観察装置及び電子部品観察方法
JPH03186704A (ja) 認識装置
CN117546091A (zh) 对位校正系统及其方法