JPS6223456B2 - - Google Patents
Info
- Publication number
- JPS6223456B2 JPS6223456B2 JP58156257A JP15625783A JPS6223456B2 JP S6223456 B2 JPS6223456 B2 JP S6223456B2 JP 58156257 A JP58156257 A JP 58156257A JP 15625783 A JP15625783 A JP 15625783A JP S6223456 B2 JPS6223456 B2 JP S6223456B2
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- image
- pads
- pad
- imaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/60—Analysis of geometric attributes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Geometry (AREA)
- Computer Vision & Pattern Recognition (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Wire Bonding (AREA)
- Image Analysis (AREA)
- Image Processing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58156257A JPS5990162A (ja) | 1983-08-29 | 1983-08-29 | 位置検出装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58156257A JPS5990162A (ja) | 1983-08-29 | 1983-08-29 | 位置検出装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5651976A Division JPS52140278A (en) | 1976-05-19 | 1976-05-19 | Position detector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5990162A JPS5990162A (ja) | 1984-05-24 |
| JPS6223456B2 true JPS6223456B2 (enrdf_load_stackoverflow) | 1987-05-22 |
Family
ID=15623837
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58156257A Granted JPS5990162A (ja) | 1983-08-29 | 1983-08-29 | 位置検出装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5990162A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5199084A (en) * | 1991-08-16 | 1993-03-30 | International Business Machines Corporation | Apparatus and method for locating characters on a label |
-
1983
- 1983-08-29 JP JP58156257A patent/JPS5990162A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5990162A (ja) | 1984-05-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0041870B1 (en) | Pattern position recognition apparatus | |
| EP0657917A1 (en) | Wire bonding apparatus | |
| EP0823037A1 (en) | Method and system for triangulation-based, 3-d imaging utilizing an angled scanning beam of radiant energy | |
| TWI798619B (zh) | 晶粒接合裝置及半導體裝置之製造方法 | |
| KR960001824B1 (ko) | 와이어 본딩 검사 장치 | |
| JP2018152375A (ja) | ダイボンディング装置および半導体装置の製造方法 | |
| JPS6223456B2 (enrdf_load_stackoverflow) | ||
| JPS6223457B2 (enrdf_load_stackoverflow) | ||
| JPS623578B2 (enrdf_load_stackoverflow) | ||
| US6510240B1 (en) | Automatic detection of die absence on the wire bonding machine | |
| KR100261605B1 (ko) | 칩 마운터용 고정도 화상 입력장치 | |
| JPH10132524A (ja) | 基板検査装置 | |
| JP2019149440A (ja) | ダイボンディング装置および半導体装置の製造方法 | |
| JP7561070B2 (ja) | ダイボンディング装置および半導体装置の製造方法 | |
| TWI786739B (zh) | 晶粒接合裝置及半導體裝置之製造方法 | |
| JP7714414B2 (ja) | ダイボンディング装置および半導体装置の製造方法 | |
| JPH04315905A (ja) | 物体検査装置 | |
| KR100231274B1 (ko) | 패턴 인식 장치 및 이를 이용한 그라운드 본딩 위치 인식 방법 | |
| GB1592368A (en) | Automated manipulative operation system | |
| JP2644263B2 (ja) | 位置認識装置 | |
| JPH0732188B2 (ja) | 半導体装置の検査装置 | |
| JP3006437B2 (ja) | 電子部品観察装置及び電子部品観察方法 | |
| JPS5867033A (ja) | ワイヤボンデイング方法 | |
| CN117546091A (zh) | 对位校正系统及其方法 | |
| JP2966045B2 (ja) | 加工装置のための動作量補正方法及び装置 |