JPS6223457B2 - - Google Patents

Info

Publication number
JPS6223457B2
JPS6223457B2 JP58156258A JP15625883A JPS6223457B2 JP S6223457 B2 JPS6223457 B2 JP S6223457B2 JP 58156258 A JP58156258 A JP 58156258A JP 15625883 A JP15625883 A JP 15625883A JP S6223457 B2 JPS6223457 B2 JP S6223457B2
Authority
JP
Japan
Prior art keywords
pellet
threshold value
signal
image
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58156258A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5981767A (ja
Inventor
Michihiro Mese
Seiji Kashioka
Masakazu Ejiri
Takafumi Myatake
Isamu Yamazaki
Toshimitsu Hamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58156258A priority Critical patent/JPS5981767A/ja
Publication of JPS5981767A publication Critical patent/JPS5981767A/ja
Publication of JPS6223457B2 publication Critical patent/JPS6223457B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
JP58156258A 1983-08-29 1983-08-29 信号処理装置 Granted JPS5981767A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58156258A JPS5981767A (ja) 1983-08-29 1983-08-29 信号処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58156258A JPS5981767A (ja) 1983-08-29 1983-08-29 信号処理装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP5651976A Division JPS52140278A (en) 1976-05-19 1976-05-19 Position detector

Publications (2)

Publication Number Publication Date
JPS5981767A JPS5981767A (ja) 1984-05-11
JPS6223457B2 true JPS6223457B2 (enrdf_load_stackoverflow) 1987-05-22

Family

ID=15623861

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58156258A Granted JPS5981767A (ja) 1983-08-29 1983-08-29 信号処理装置

Country Status (1)

Country Link
JP (1) JPS5981767A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2805771B2 (ja) * 1988-10-12 1998-09-30 株式会社ニコン アライメント方法
JP2000260699A (ja) 1999-03-09 2000-09-22 Canon Inc 位置検出装置及び該位置検出装置を用いた半導体露光装置

Also Published As

Publication number Publication date
JPS5981767A (ja) 1984-05-11

Similar Documents

Publication Publication Date Title
EP0041870B1 (en) Pattern position recognition apparatus
US5369492A (en) Bonding wire inspection apparatus
JP2851151B2 (ja) ワイヤボンディング検査装置
US5347362A (en) Bonding wire inspection method
KR20000016975A (ko) 격자 어레이 검사 시스템 및 방법
JPS6223457B2 (enrdf_load_stackoverflow)
JPS6223456B2 (enrdf_load_stackoverflow)
JPS623578B2 (enrdf_load_stackoverflow)
US6510240B1 (en) Automatic detection of die absence on the wire bonding machine
JP3419118B2 (ja) 外観検査装置
JPS60227431A (ja) ダイボンデイング状態の検査装置
JPH07294450A (ja) 高密度表面実装基板の半田付検査方法
JP2644263B2 (ja) 位置認識装置
KR100231274B1 (ko) 패턴 인식 장치 및 이를 이용한 그라운드 본딩 위치 인식 방법
JPH06102024A (ja) ワイヤ検査装置及び検査方法
JP3006437B2 (ja) 電子部品観察装置及び電子部品観察方法
JPH04315905A (ja) 物体検査装置
JP2966045B2 (ja) 加工装置のための動作量補正方法及び装置
JPH03186704A (ja) 認識装置
JPH05340733A (ja) 半導体装置の検査装置
KR20000001920A (ko) 본딩와이어 검사장치 및 그 검사방법
JPS6342410B2 (enrdf_load_stackoverflow)
KR100482586B1 (ko) 차량 투영면적 측정 시스템
JP3057830U (ja) 集積回路基板はんだ点の金属メッキの検出装置
JP2023041413A (ja) ダイボンディング装置および半導体装置の製造方法