JPS6223457B2 - - Google Patents
Info
- Publication number
- JPS6223457B2 JPS6223457B2 JP58156258A JP15625883A JPS6223457B2 JP S6223457 B2 JPS6223457 B2 JP S6223457B2 JP 58156258 A JP58156258 A JP 58156258A JP 15625883 A JP15625883 A JP 15625883A JP S6223457 B2 JPS6223457 B2 JP S6223457B2
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- threshold value
- signal
- image
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 238000003384 imaging method Methods 0.000 claims description 2
- 239000008188 pellet Substances 0.000 description 33
- 238000001514 detection method Methods 0.000 description 9
- 230000000007 visual effect Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- OFLYIWITHZJFLS-UHFFFAOYSA-N [Si].[Au] Chemical compound [Si].[Au] OFLYIWITHZJFLS-UHFFFAOYSA-N 0.000 description 4
- 230000005496 eutectics Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 231100000241 scar Toxicity 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical group [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 3
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000003340 mental effect Effects 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical group C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000012567 pattern recognition method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Image Processing (AREA)
- Image Analysis (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58156258A JPS5981767A (ja) | 1983-08-29 | 1983-08-29 | 信号処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58156258A JPS5981767A (ja) | 1983-08-29 | 1983-08-29 | 信号処理装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5651976A Division JPS52140278A (en) | 1976-05-19 | 1976-05-19 | Position detector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5981767A JPS5981767A (ja) | 1984-05-11 |
| JPS6223457B2 true JPS6223457B2 (enrdf_load_stackoverflow) | 1987-05-22 |
Family
ID=15623861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58156258A Granted JPS5981767A (ja) | 1983-08-29 | 1983-08-29 | 信号処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5981767A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2805771B2 (ja) * | 1988-10-12 | 1998-09-30 | 株式会社ニコン | アライメント方法 |
| JP2000260699A (ja) | 1999-03-09 | 2000-09-22 | Canon Inc | 位置検出装置及び該位置検出装置を用いた半導体露光装置 |
-
1983
- 1983-08-29 JP JP58156258A patent/JPS5981767A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5981767A (ja) | 1984-05-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0041870B1 (en) | Pattern position recognition apparatus | |
| US5369492A (en) | Bonding wire inspection apparatus | |
| JP2851151B2 (ja) | ワイヤボンディング検査装置 | |
| JPS6223457B2 (enrdf_load_stackoverflow) | ||
| JPS6223456B2 (enrdf_load_stackoverflow) | ||
| JPS623578B2 (enrdf_load_stackoverflow) | ||
| US6510240B1 (en) | Automatic detection of die absence on the wire bonding machine | |
| KR100261605B1 (ko) | 칩 마운터용 고정도 화상 입력장치 | |
| JPS60227431A (ja) | ダイボンデイング状態の検査装置 | |
| JPH07294450A (ja) | 高密度表面実装基板の半田付検査方法 | |
| JP2644263B2 (ja) | 位置認識装置 | |
| KR100231274B1 (ko) | 패턴 인식 장치 및 이를 이용한 그라운드 본딩 위치 인식 방법 | |
| JP3006437B2 (ja) | 電子部品観察装置及び電子部品観察方法 | |
| JPH04315905A (ja) | 物体検査装置 | |
| JP2966045B2 (ja) | 加工装置のための動作量補正方法及び装置 | |
| JPH05340733A (ja) | 半導体装置の検査装置 | |
| KR20000001920A (ko) | 본딩와이어 검사장치 및 그 검사방법 | |
| JPS6342410B2 (enrdf_load_stackoverflow) | ||
| JPS5870380A (ja) | 物体の認識装置 | |
| JPS5867033A (ja) | ワイヤボンデイング方法 | |
| JPH03186704A (ja) | 認識装置 | |
| JP2023041413A (ja) | ダイボンディング装置および半導体装置の製造方法 | |
| KR830001955B1 (ko) | 와이어 본딩장치 | |
| JPS60125547A (ja) | 検査装置 | |
| JPS5995674A (ja) | パタ−ン認識方法及びその装置 |