JPS6234144B2 - - Google Patents
Info
- Publication number
- JPS6234144B2 JPS6234144B2 JP17320380A JP17320380A JPS6234144B2 JP S6234144 B2 JPS6234144 B2 JP S6234144B2 JP 17320380 A JP17320380 A JP 17320380A JP 17320380 A JP17320380 A JP 17320380A JP S6234144 B2 JPS6234144 B2 JP S6234144B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- board
- input
- pedestal
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000012360 testing method Methods 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 29
- 239000004065 semiconductor Substances 0.000 claims description 21
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 20
- 239000011521 glass Substances 0.000 claims description 10
- 230000003287 optical effect Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 2
- 239000012780 transparent material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 19
- 229910000679 solder Inorganic materials 0.000 description 9
- 239000004020 conductor Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17320380A JPS5797637A (en) | 1980-12-10 | 1980-12-10 | Substrate for test of semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17320380A JPS5797637A (en) | 1980-12-10 | 1980-12-10 | Substrate for test of semiconductor chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5797637A JPS5797637A (en) | 1982-06-17 |
| JPS6234144B2 true JPS6234144B2 (enrdf_load_stackoverflow) | 1987-07-24 |
Family
ID=15956016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17320380A Granted JPS5797637A (en) | 1980-12-10 | 1980-12-10 | Substrate for test of semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5797637A (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6481333A (en) * | 1987-09-24 | 1989-03-27 | Hitachi Ltd | Test board for flip-chip |
| US7476555B2 (en) * | 2006-11-15 | 2009-01-13 | Airdio Wireless Inc. | Method of chip manufacturing |
-
1980
- 1980-12-10 JP JP17320380A patent/JPS5797637A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5797637A (en) | 1982-06-17 |
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