JPS5797637A - Substrate for test of semiconductor chip - Google Patents

Substrate for test of semiconductor chip

Info

Publication number
JPS5797637A
JPS5797637A JP17320380A JP17320380A JPS5797637A JP S5797637 A JPS5797637 A JP S5797637A JP 17320380 A JP17320380 A JP 17320380A JP 17320380 A JP17320380 A JP 17320380A JP S5797637 A JPS5797637 A JP S5797637A
Authority
JP
Japan
Prior art keywords
substrate
size
earth layer
conductors
characteristic impedance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17320380A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6234144B2 (enrdf_load_stackoverflow
Inventor
Fumiyuki Kobayashi
Katsumi Yabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP17320380A priority Critical patent/JPS5797637A/ja
Publication of JPS5797637A publication Critical patent/JPS5797637A/ja
Publication of JPS6234144B2 publication Critical patent/JPS6234144B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP17320380A 1980-12-10 1980-12-10 Substrate for test of semiconductor chip Granted JPS5797637A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17320380A JPS5797637A (en) 1980-12-10 1980-12-10 Substrate for test of semiconductor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17320380A JPS5797637A (en) 1980-12-10 1980-12-10 Substrate for test of semiconductor chip

Publications (2)

Publication Number Publication Date
JPS5797637A true JPS5797637A (en) 1982-06-17
JPS6234144B2 JPS6234144B2 (enrdf_load_stackoverflow) 1987-07-24

Family

ID=15956016

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17320380A Granted JPS5797637A (en) 1980-12-10 1980-12-10 Substrate for test of semiconductor chip

Country Status (1)

Country Link
JP (1) JPS5797637A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6481333A (en) * 1987-09-24 1989-03-27 Hitachi Ltd Test board for flip-chip
EP1930941A3 (en) * 2006-11-15 2008-08-20 AirDio Wireless Inc. Method of chip manufacturing

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6481333A (en) * 1987-09-24 1989-03-27 Hitachi Ltd Test board for flip-chip
EP1930941A3 (en) * 2006-11-15 2008-08-20 AirDio Wireless Inc. Method of chip manufacturing

Also Published As

Publication number Publication date
JPS6234144B2 (enrdf_load_stackoverflow) 1987-07-24

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