JPS6234140B2 - - Google Patents

Info

Publication number
JPS6234140B2
JPS6234140B2 JP56126178A JP12617881A JPS6234140B2 JP S6234140 B2 JPS6234140 B2 JP S6234140B2 JP 56126178 A JP56126178 A JP 56126178A JP 12617881 A JP12617881 A JP 12617881A JP S6234140 B2 JPS6234140 B2 JP S6234140B2
Authority
JP
Japan
Prior art keywords
bonding
tool
polishing
semiconductor element
bonding tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56126178A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5828845A (ja
Inventor
Hiroshi Aoyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP56126178A priority Critical patent/JPS5828845A/ja
Publication of JPS5828845A publication Critical patent/JPS5828845A/ja
Publication of JPS6234140B2 publication Critical patent/JPS6234140B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP56126178A 1981-08-12 1981-08-12 半導体装置の製造装置 Granted JPS5828845A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56126178A JPS5828845A (ja) 1981-08-12 1981-08-12 半導体装置の製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56126178A JPS5828845A (ja) 1981-08-12 1981-08-12 半導体装置の製造装置

Publications (2)

Publication Number Publication Date
JPS5828845A JPS5828845A (ja) 1983-02-19
JPS6234140B2 true JPS6234140B2 (enExample) 1987-07-24

Family

ID=14928608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56126178A Granted JPS5828845A (ja) 1981-08-12 1981-08-12 半導体装置の製造装置

Country Status (1)

Country Link
JP (1) JPS5828845A (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63256402A (ja) * 1987-04-15 1988-10-24 日本化学工業株式会社 木材防虫剤、防虫木材用接着剤及び防虫木材
JP2699202B2 (ja) * 1989-07-19 1998-01-19 旭ダイヤモンド工業株式会社 Ｔａｂ用ボンディングツールのクリーニング砥石

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5524448A (en) * 1978-08-09 1980-02-21 Fujitsu Ltd Junction head
JPS55157439A (en) * 1979-05-21 1980-12-08 Mitsubishi Electric Corp Electric discharge machining device

Also Published As

Publication number Publication date
JPS5828845A (ja) 1983-02-19

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