JPS5828845A - 半導体装置の製造装置 - Google Patents

半導体装置の製造装置

Info

Publication number
JPS5828845A
JPS5828845A JP56126178A JP12617881A JPS5828845A JP S5828845 A JPS5828845 A JP S5828845A JP 56126178 A JP56126178 A JP 56126178A JP 12617881 A JP12617881 A JP 12617881A JP S5828845 A JPS5828845 A JP S5828845A
Authority
JP
Japan
Prior art keywords
bonding
tool
polishing
semiconductor device
stage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56126178A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6234140B2 (enExample
Inventor
Hiroshi Aoyama
弘 青山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP56126178A priority Critical patent/JPS5828845A/ja
Publication of JPS5828845A publication Critical patent/JPS5828845A/ja
Publication of JPS6234140B2 publication Critical patent/JPS6234140B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP56126178A 1981-08-12 1981-08-12 半導体装置の製造装置 Granted JPS5828845A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56126178A JPS5828845A (ja) 1981-08-12 1981-08-12 半導体装置の製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56126178A JPS5828845A (ja) 1981-08-12 1981-08-12 半導体装置の製造装置

Publications (2)

Publication Number Publication Date
JPS5828845A true JPS5828845A (ja) 1983-02-19
JPS6234140B2 JPS6234140B2 (enExample) 1987-07-24

Family

ID=14928608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56126178A Granted JPS5828845A (ja) 1981-08-12 1981-08-12 半導体装置の製造装置

Country Status (1)

Country Link
JP (1) JPS5828845A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63256402A (ja) * 1987-04-15 1988-10-24 日本化学工業株式会社 木材防虫剤、防虫木材用接着剤及び防虫木材
JPH03161272A (ja) * 1989-07-19 1991-07-11 Asahi Daiyamondo Kogyo Kk Ｔａｂ用ボンディングツールのクリーニング砥石

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5524448A (en) * 1978-08-09 1980-02-21 Fujitsu Ltd Junction head
JPS55157439A (en) * 1979-05-21 1980-12-08 Mitsubishi Electric Corp Electric discharge machining device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5524448A (en) * 1978-08-09 1980-02-21 Fujitsu Ltd Junction head
JPS55157439A (en) * 1979-05-21 1980-12-08 Mitsubishi Electric Corp Electric discharge machining device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63256402A (ja) * 1987-04-15 1988-10-24 日本化学工業株式会社 木材防虫剤、防虫木材用接着剤及び防虫木材
JPH03161272A (ja) * 1989-07-19 1991-07-11 Asahi Daiyamondo Kogyo Kk Ｔａｂ用ボンディングツールのクリーニング砥石

Also Published As

Publication number Publication date
JPS6234140B2 (enExample) 1987-07-24

Similar Documents

Publication Publication Date Title
CN112117204B (zh) 一种封装结构的制作方法
US8962470B2 (en) Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus
KR100640112B1 (ko) 적층형 ｍｃｐ 및 그 제조 방법
JP2735820B2 (ja) 回転運動をするピックアップツールを備えたダイボンディング装置およびダイボンディング方法
JP4330821B2 (ja) 半導体装置の製造方法
CN110031277A (zh) 一种用于失效分析的芯片样品制作方法
KR100486290B1 (ko) 반도체 패키지 조립방법 및 반도체 패키지 공정의보호테이프 제거장치
CN1270375C (zh) 集成电路芯片与电路基片的连接方法及其应用
JPS5828845A (ja) 半導体装置の製造装置
US20020003431A1 (en) Method and device for supporting flip chip circuitry in analysis
JPS6222439A (ja) ウエ−ハ保護テ−プ
JP2007165706A (ja) 半導体集積回路装置の製造方法
TWI850289B (zh) 附基台刀片
US20030059981A1 (en) Semiconductor device, method of producing the same and semiconductor production equipment for carrying out the method
JPH05343658A (ja) 固体撮像装置のパッケージ構造
CN111799218A (zh) 晶片的分割方法
CN111805776A (zh) 带基台的刀具
JPH10209089A (ja) 半導体ウェーハの研磨方法
JPH07193101A (ja) 導電ペースト転写方法
JP7152882B2 (ja) 被加工物ユニットの保持方法
JP2000269243A (ja) ペレットボンディング方法及び装置
JPH0758134A (ja) 半導体装置及びその実装装置及びその実装方法
JP3836414B2 (ja) 半導体装置の製造装置、ヒートコマ及び半導体装置の製造方法
JP2769193B2 (ja) ボンディング装置
JP2960794B2 (ja) ボンディング方法