JPS6232604B2 - - Google Patents
Info
- Publication number
- JPS6232604B2 JPS6232604B2 JP13817778A JP13817778A JPS6232604B2 JP S6232604 B2 JPS6232604 B2 JP S6232604B2 JP 13817778 A JP13817778 A JP 13817778A JP 13817778 A JP13817778 A JP 13817778A JP S6232604 B2 JPS6232604 B2 JP S6232604B2
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- layer
- nickel
- tin
- barrel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 32
- 238000000034 method Methods 0.000 description 26
- 239000003985 ceramic capacitor Substances 0.000 description 22
- 229910052759 nickel Inorganic materials 0.000 description 16
- 238000007747 plating Methods 0.000 description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 12
- 229910052718 tin Inorganic materials 0.000 description 12
- 239000000919 ceramic Substances 0.000 description 11
- 229910052573 porcelain Inorganic materials 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 238000005530 etching Methods 0.000 description 10
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 10
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 238000003486 chemical etching Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 229960002050 hydrofluoric acid Drugs 0.000 description 5
- 229910052763 palladium Inorganic materials 0.000 description 5
- 229910052697 platinum Inorganic materials 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 4
- 239000010953 base metal Substances 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 4
- 239000003989 dielectric material Substances 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 4
- 229910017604 nitric acid Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000003792 electrolyte Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910000510 noble metal Inorganic materials 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- TVQLLNFANZSCGY-UHFFFAOYSA-N disodium;dioxido(oxo)tin Chemical compound [Na+].[Na+].[O-][Sn]([O-])=O TVQLLNFANZSCGY-UHFFFAOYSA-N 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 239000002659 electrodeposit Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229940079864 sodium stannate Drugs 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13817778A JPS5563817A (en) | 1978-11-08 | 1978-11-08 | Method of manufacturing laminated porcelain capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13817778A JPS5563817A (en) | 1978-11-08 | 1978-11-08 | Method of manufacturing laminated porcelain capacitor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5563817A JPS5563817A (en) | 1980-05-14 |
JPS6232604B2 true JPS6232604B2 (enrdf_load_stackoverflow) | 1987-07-15 |
Family
ID=15215838
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13817778A Granted JPS5563817A (en) | 1978-11-08 | 1978-11-08 | Method of manufacturing laminated porcelain capacitor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5563817A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2616785B2 (ja) * | 1987-12-10 | 1997-06-04 | 松下電器産業株式会社 | 積層セラミックコンデンサの外部電極の形成方法 |
JPH0727622Y2 (ja) * | 1989-03-07 | 1995-06-21 | 太陽誘電株式会社 | チップ状セラミック電子部品 |
-
1978
- 1978-11-08 JP JP13817778A patent/JPS5563817A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS5563817A (en) | 1980-05-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6310757B1 (en) | Electronic component having external electrodes and method for the manufacture thereof | |
US5036434A (en) | Chip-type solid electrolytic capacitor and method of manufacturing the same | |
JPS6258125B2 (enrdf_load_stackoverflow) | ||
WO2005083727A1 (ja) | 積層型セラミック電子部品及びその製造方法 | |
US5168434A (en) | Fuse-incorporated, chip-type solid electrolytic capacitor | |
JPS6232604B2 (enrdf_load_stackoverflow) | ||
JPS63104314A (ja) | チツプコンデンサの電極端子の形成方法 | |
JPS5874030A (ja) | 電子部品、導電皮膜組成物及び製造方法 | |
JPWO2022230304A5 (enrdf_load_stackoverflow) | ||
JPH07258897A (ja) | 不溶性電極及びその製造方法 | |
JPH09260106A (ja) | 電子部品の製造方法 | |
JPH0722268A (ja) | チップ型電子部品 | |
JPS6226166B2 (enrdf_load_stackoverflow) | ||
JP3341725B2 (ja) | 電子部品の製造方法及びバレルメッキ装置 | |
JP3478041B2 (ja) | チップ状固体電解コンデンサの製造方法 | |
JP2000077253A (ja) | 電子部品、チップ型セラミック電子部品、およびそれらの製造方法 | |
JPS6322046B2 (enrdf_load_stackoverflow) | ||
JP3531794B2 (ja) | セラミック電子部品の端子電極形成方法 | |
JPH0729625Y2 (ja) | 積層型lc複合部品 | |
JP2787743B2 (ja) | 貫通型磁器コンデンサ | |
TWI295207B (en) | A re-plating process for a passive component | |
JP2626028B2 (ja) | 半導体セラミック電子部品の製造方法 | |
JP3810206B2 (ja) | 配線基板 | |
JPS5963716A (ja) | 固体電解コンデンサの製造方法 | |
JPS62242323A (ja) | チツプコンデンサ− |