JPS6231190A - 電子回路基板及びその製造方法 - Google Patents
電子回路基板及びその製造方法Info
- Publication number
- JPS6231190A JPS6231190A JP17045885A JP17045885A JPS6231190A JP S6231190 A JPS6231190 A JP S6231190A JP 17045885 A JP17045885 A JP 17045885A JP 17045885 A JP17045885 A JP 17045885A JP S6231190 A JPS6231190 A JP S6231190A
- Authority
- JP
- Japan
- Prior art keywords
- conductive paint
- paint layer
- circuit board
- layer
- electronic circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000003973 paint Substances 0.000 claims description 76
- 239000010410 layer Substances 0.000 claims description 74
- 239000000758 substrate Substances 0.000 claims description 34
- 238000007772 electroless plating Methods 0.000 claims description 22
- 238000010304 firing Methods 0.000 claims description 21
- 238000005476 soldering Methods 0.000 claims description 20
- 238000007747 plating Methods 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 16
- 239000011162 core material Substances 0.000 claims description 14
- 239000011241 protective layer Substances 0.000 claims description 10
- 229920001187 thermosetting polymer Polymers 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 5
- 239000003990 capacitor Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 10
- 229910000679 solder Inorganic materials 0.000 description 8
- 238000007639 printing Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17045885A JPS6231190A (ja) | 1985-08-01 | 1985-08-01 | 電子回路基板及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17045885A JPS6231190A (ja) | 1985-08-01 | 1985-08-01 | 電子回路基板及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6231190A true JPS6231190A (ja) | 1987-02-10 |
| JPH0584679B2 JPH0584679B2 (enrdf_load_stackoverflow) | 1993-12-02 |
Family
ID=15905310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17045885A Granted JPS6231190A (ja) | 1985-08-01 | 1985-08-01 | 電子回路基板及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6231190A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006253710A (ja) * | 2006-05-08 | 2006-09-21 | Matsushita Electric Works Ltd | プリント配線板の製造方法及びプリント配線板 |
| WO2017141984A1 (ja) * | 2016-02-17 | 2017-08-24 | ナミックス株式会社 | 導電性ペースト |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0977173A (ja) * | 1995-09-13 | 1997-03-25 | Mitsumoto:Kk | 磁気テープカセット用収納ケース |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6059764A (ja) * | 1983-09-13 | 1985-04-06 | Mitsubishi Electric Corp | 混成集積回路基板の製造方法 |
| JPS6059765A (ja) * | 1983-09-13 | 1985-04-06 | Mitsubishi Electric Corp | 混成集積回路基板の製造方法 |
-
1985
- 1985-08-01 JP JP17045885A patent/JPS6231190A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6059764A (ja) * | 1983-09-13 | 1985-04-06 | Mitsubishi Electric Corp | 混成集積回路基板の製造方法 |
| JPS6059765A (ja) * | 1983-09-13 | 1985-04-06 | Mitsubishi Electric Corp | 混成集積回路基板の製造方法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006253710A (ja) * | 2006-05-08 | 2006-09-21 | Matsushita Electric Works Ltd | プリント配線板の製造方法及びプリント配線板 |
| WO2017141984A1 (ja) * | 2016-02-17 | 2017-08-24 | ナミックス株式会社 | 導電性ペースト |
| JPWO2017141984A1 (ja) * | 2016-02-17 | 2018-12-13 | ナミックス株式会社 | 導電性ペースト |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0584679B2 (enrdf_load_stackoverflow) | 1993-12-02 |
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