JPS6230516B2 - - Google Patents
Info
- Publication number
- JPS6230516B2 JPS6230516B2 JP957079A JP957079A JPS6230516B2 JP S6230516 B2 JPS6230516 B2 JP S6230516B2 JP 957079 A JP957079 A JP 957079A JP 957079 A JP957079 A JP 957079A JP S6230516 B2 JPS6230516 B2 JP S6230516B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit boards
- terminal
- solder
- circuit board
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000010438 heat treatment Methods 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 17
- 238000005476 soldering Methods 0.000 claims description 8
- 229910000679 solder Inorganic materials 0.000 description 22
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 18
- 238000003825 pressing Methods 0.000 description 12
- 229910052742 iron Inorganic materials 0.000 description 9
- 239000000758 substrate Substances 0.000 description 9
- 239000012790 adhesive layer Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000155 melt Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000004904 shortening Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 206010040844 Skin exfoliation Diseases 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP957079A JPS55102298A (en) | 1979-01-29 | 1979-01-29 | Method of connecting wiring patterns of circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP957079A JPS55102298A (en) | 1979-01-29 | 1979-01-29 | Method of connecting wiring patterns of circuit boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55102298A JPS55102298A (en) | 1980-08-05 |
| JPS6230516B2 true JPS6230516B2 (enExample) | 1987-07-02 |
Family
ID=11723950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP957079A Granted JPS55102298A (en) | 1979-01-29 | 1979-01-29 | Method of connecting wiring patterns of circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55102298A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5489646B2 (ja) * | 2009-10-28 | 2014-05-14 | 黒田テクノ株式会社 | 半田付け方法および装置 |
-
1979
- 1979-01-29 JP JP957079A patent/JPS55102298A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS55102298A (en) | 1980-08-05 |
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