JPS6230500B2 - - Google Patents
Info
- Publication number
- JPS6230500B2 JPS6230500B2 JP7820479A JP7820479A JPS6230500B2 JP S6230500 B2 JPS6230500 B2 JP S6230500B2 JP 7820479 A JP7820479 A JP 7820479A JP 7820479 A JP7820479 A JP 7820479A JP S6230500 B2 JPS6230500 B2 JP S6230500B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- electrodes
- mounting means
- electric
- laminated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 230000003321 amplification Effects 0.000 claims description 6
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 6
- 239000013078 crystal Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000003989 dielectric material Substances 0.000 claims description 2
- 238000001514 detection method Methods 0.000 claims 2
- 238000005516 engineering process Methods 0.000 claims 2
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 claims 2
- 239000004642 Polyimide Substances 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 239000011295 pitch Substances 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 71
- 239000000758 substrate Substances 0.000 description 13
- 239000003990 capacitor Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 6
- 239000012212 insulator Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 230000008054 signal transmission Effects 0.000 description 6
- 239000012535 impurity Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- -1 phosphorus ions Chemical class 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
- H01L23/5223—Capacitor integral with wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7820479A JPS562662A (en) | 1979-06-22 | 1979-06-22 | Laminated electric circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7820479A JPS562662A (en) | 1979-06-22 | 1979-06-22 | Laminated electric circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS562662A JPS562662A (en) | 1981-01-12 |
| JPS6230500B2 true JPS6230500B2 (enrdf_load_stackoverflow) | 1987-07-02 |
Family
ID=13655487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7820479A Granted JPS562662A (en) | 1979-06-22 | 1979-06-22 | Laminated electric circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS562662A (enrdf_load_stackoverflow) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61180468A (ja) * | 1985-02-06 | 1986-08-13 | Agency Of Ind Science & Technol | 積層半導体装置 |
| US4893174A (en) * | 1985-07-08 | 1990-01-09 | Hitachi, Ltd. | High density integration of semiconductor circuit |
| JPS6220362A (ja) * | 1985-07-19 | 1987-01-28 | Hitachi Ltd | 積層電気回路用信号伝送回路 |
| US5165010A (en) * | 1989-01-06 | 1992-11-17 | Hitachi, Ltd. | Information processing system |
| US6812046B2 (en) * | 2002-07-29 | 2004-11-02 | Sun Microsystems Inc. | Method and apparatus for electronically aligning capacitively coupled chip pads |
| US7200830B2 (en) * | 2003-09-05 | 2007-04-03 | Sun Microsystems, Inc. | Enhanced electrically-aligned proximity communication |
| JP4858692B2 (ja) * | 2006-06-22 | 2012-01-18 | 日本電気株式会社 | チップ積層型半導体装置 |
| JP5471439B2 (ja) | 2007-03-09 | 2014-04-16 | 日本電気株式会社 | 半導体チップ及び半導体装置 |
-
1979
- 1979-06-22 JP JP7820479A patent/JPS562662A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS562662A (en) | 1981-01-12 |
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