JPS62293622A - 半導体基板の熱処理装置 - Google Patents
半導体基板の熱処理装置Info
- Publication number
- JPS62293622A JPS62293622A JP61137349A JP13734986A JPS62293622A JP S62293622 A JPS62293622 A JP S62293622A JP 61137349 A JP61137349 A JP 61137349A JP 13734986 A JP13734986 A JP 13734986A JP S62293622 A JPS62293622 A JP S62293622A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- heating source
- chamber
- heat treatment
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 title claims description 92
- 239000004065 semiconductor Substances 0.000 title claims description 8
- 239000000758 substrate Substances 0.000 title claims description 7
- 238000009529 body temperature measurement Methods 0.000 claims description 27
- 230000005855 radiation Effects 0.000 claims description 14
- 238000001816 cooling Methods 0.000 claims description 9
- 238000009826 distribution Methods 0.000 description 47
- 239000010453 quartz Substances 0.000 description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 229910052736 halogen Inorganic materials 0.000 description 5
- 150000002367 halogens Chemical class 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000004364 calculation method Methods 0.000 description 4
- 230000000295 complement effect Effects 0.000 description 4
- 238000012937 correction Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 2
- 240000005343 Azadirachta indica Species 0.000 description 1
- 235000013500 Melia azadirachta Nutrition 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910001634 calcium fluoride Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 235000009508 confectionery Nutrition 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 210000004907 gland Anatomy 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61137349A JPS62293622A (ja) | 1986-06-12 | 1986-06-12 | 半導体基板の熱処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61137349A JPS62293622A (ja) | 1986-06-12 | 1986-06-12 | 半導体基板の熱処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62293622A true JPS62293622A (ja) | 1987-12-21 |
| JPH0542135B2 JPH0542135B2 (enExample) | 1993-06-25 |
Family
ID=15196569
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61137349A Granted JPS62293622A (ja) | 1986-06-12 | 1986-06-12 | 半導体基板の熱処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62293622A (enExample) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01259528A (ja) * | 1988-04-08 | 1989-10-17 | Hitachi Ltd | 半導体ウエハ熱処理装置のウエハ支持装置及び半導体ウエハ熱処理装置 |
| JPH01270315A (ja) * | 1988-04-22 | 1989-10-27 | Fujitsu Ltd | 半導体ウェーハ熱処理装置 |
| JPH01319934A (ja) * | 1988-05-09 | 1989-12-26 | Siemens Ag | 電磁放射照射による半導体円板の急速熱処理方法 |
| JPH0214514A (ja) * | 1988-03-23 | 1990-01-18 | High Temperature Eng Corp | 半導体処理の為の急熱炉 |
| JPH0269932A (ja) * | 1988-09-05 | 1990-03-08 | Hitachi Ltd | 半導体ウェハの熱処理装置、及び熱処理方法 |
| JP2006503434A (ja) * | 2002-10-16 | 2006-01-26 | バリアン・セミコンダクター・イクイップメント・アソシエーツ・インコーポレーテッド | アニール不均一性を補償するための方法及びシステム |
| JP2019168669A (ja) * | 2018-03-23 | 2019-10-03 | 北京創▲いく▼科技有限公司 | 加熱部材 |
| JP7236174B1 (ja) * | 2021-04-20 | 2023-03-09 | 株式会社九州日昌 | 加熱装置 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005298991A (ja) * | 2004-04-08 | 2005-10-27 | National Institute Of Advanced Industrial & Technology | 繊維の熱処理方法およびこれを実施するための装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS599631U (ja) * | 1982-03-15 | 1984-01-21 | ミツミ電機株式会社 | 複合超音波遅延装置 |
| JPS6050531U (ja) * | 1983-09-13 | 1985-04-09 | 旭硝子株式会社 | 超音波遅延回路 |
-
1986
- 1986-06-12 JP JP61137349A patent/JPS62293622A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS599631U (ja) * | 1982-03-15 | 1984-01-21 | ミツミ電機株式会社 | 複合超音波遅延装置 |
| JPS6050531U (ja) * | 1983-09-13 | 1985-04-09 | 旭硝子株式会社 | 超音波遅延回路 |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0214514A (ja) * | 1988-03-23 | 1990-01-18 | High Temperature Eng Corp | 半導体処理の為の急熱炉 |
| JPH01259528A (ja) * | 1988-04-08 | 1989-10-17 | Hitachi Ltd | 半導体ウエハ熱処理装置のウエハ支持装置及び半導体ウエハ熱処理装置 |
| JPH01270315A (ja) * | 1988-04-22 | 1989-10-27 | Fujitsu Ltd | 半導体ウェーハ熱処理装置 |
| JPH01319934A (ja) * | 1988-05-09 | 1989-12-26 | Siemens Ag | 電磁放射照射による半導体円板の急速熱処理方法 |
| JPH0269932A (ja) * | 1988-09-05 | 1990-03-08 | Hitachi Ltd | 半導体ウェハの熱処理装置、及び熱処理方法 |
| JP2006503434A (ja) * | 2002-10-16 | 2006-01-26 | バリアン・セミコンダクター・イクイップメント・アソシエーツ・インコーポレーテッド | アニール不均一性を補償するための方法及びシステム |
| JP4820093B2 (ja) * | 2002-10-16 | 2011-11-24 | バリアン・セミコンダクター・イクイップメント・アソシエーツ・インコーポレーテッド | アニール不均一性を補償するための方法及びシステム |
| JP2019168669A (ja) * | 2018-03-23 | 2019-10-03 | 北京創▲いく▼科技有限公司 | 加熱部材 |
| JP7236174B1 (ja) * | 2021-04-20 | 2023-03-09 | 株式会社九州日昌 | 加熱装置 |
| US11646647B2 (en) | 2021-04-20 | 2023-05-09 | Kyushu Nissho Co., Ltd. | Heating apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0542135B2 (enExample) | 1993-06-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |