JPS62290158A - 半導体素子塔載部のセラミツクの接合構造 - Google Patents

半導体素子塔載部のセラミツクの接合構造

Info

Publication number
JPS62290158A
JPS62290158A JP13189286A JP13189286A JPS62290158A JP S62290158 A JPS62290158 A JP S62290158A JP 13189286 A JP13189286 A JP 13189286A JP 13189286 A JP13189286 A JP 13189286A JP S62290158 A JPS62290158 A JP S62290158A
Authority
JP
Japan
Prior art keywords
ceramic
semiconductor element
package
alumina
ain
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13189286A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0548953B2 (enExample
Inventor
Kazuo Kondo
和夫 近藤
Tsuneyuki Sukegawa
助川　恒之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP13189286A priority Critical patent/JPS62290158A/ja
Publication of JPS62290158A publication Critical patent/JPS62290158A/ja
Publication of JPH0548953B2 publication Critical patent/JPH0548953B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Ceramic Products (AREA)
JP13189286A 1986-06-09 1986-06-09 半導体素子塔載部のセラミツクの接合構造 Granted JPS62290158A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13189286A JPS62290158A (ja) 1986-06-09 1986-06-09 半導体素子塔載部のセラミツクの接合構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13189286A JPS62290158A (ja) 1986-06-09 1986-06-09 半導体素子塔載部のセラミツクの接合構造

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP7276502A Division JP2759777B2 (ja) 1995-09-28 1995-09-28 半導体素子搭載部のセラミックの接合構造

Publications (2)

Publication Number Publication Date
JPS62290158A true JPS62290158A (ja) 1987-12-17
JPH0548953B2 JPH0548953B2 (enExample) 1993-07-22

Family

ID=15068590

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13189286A Granted JPS62290158A (ja) 1986-06-09 1986-06-09 半導体素子塔載部のセラミツクの接合構造

Country Status (1)

Country Link
JP (1) JPS62290158A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63173348A (ja) * 1987-01-13 1988-07-16 Toshiba Corp 半導体装置
US5057376A (en) * 1988-11-15 1991-10-15 Asahi Glass Company Ltd. Hybrid package, glass ceramic substrate for the hybrid package, and composition for the glass ceramic substrate
US5138426A (en) * 1988-09-22 1992-08-11 Ngk Insulators, Ltd. Ceramic joined body
KR20010045373A (ko) * 1999-11-04 2001-06-05 마이클 디. 오브라이언 반도체 패키지

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS519042A (en) * 1974-07-12 1976-01-24 Hitachi Ltd Zaishitsunokotonaru butsushitsunohanda yosetsusetsuzokuhoho
JPS52117075A (en) * 1976-03-27 1977-10-01 Toshiba Corp Semiconductor device
JPS5446474A (en) * 1977-09-20 1979-04-12 Ngk Insulators Ltd Semiconductor package
JPS5649550A (en) * 1979-09-28 1981-05-06 Hitachi Ltd Semiconductor device
JPS5678284U (enExample) * 1979-11-09 1981-06-25
JPS61103672A (ja) * 1984-10-29 1986-05-22 Oki Electric Ind Co Ltd 接着構造

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS519042A (en) * 1974-07-12 1976-01-24 Hitachi Ltd Zaishitsunokotonaru butsushitsunohanda yosetsusetsuzokuhoho
JPS52117075A (en) * 1976-03-27 1977-10-01 Toshiba Corp Semiconductor device
JPS5446474A (en) * 1977-09-20 1979-04-12 Ngk Insulators Ltd Semiconductor package
JPS5649550A (en) * 1979-09-28 1981-05-06 Hitachi Ltd Semiconductor device
JPS5678284U (enExample) * 1979-11-09 1981-06-25
JPS61103672A (ja) * 1984-10-29 1986-05-22 Oki Electric Ind Co Ltd 接着構造

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63173348A (ja) * 1987-01-13 1988-07-16 Toshiba Corp 半導体装置
US5138426A (en) * 1988-09-22 1992-08-11 Ngk Insulators, Ltd. Ceramic joined body
US5057376A (en) * 1988-11-15 1991-10-15 Asahi Glass Company Ltd. Hybrid package, glass ceramic substrate for the hybrid package, and composition for the glass ceramic substrate
KR20010045373A (ko) * 1999-11-04 2001-06-05 마이클 디. 오브라이언 반도체 패키지

Also Published As

Publication number Publication date
JPH0548953B2 (enExample) 1993-07-22

Similar Documents

Publication Publication Date Title
US4827082A (en) Ceramic package
JP4969738B2 (ja) セラミックス回路基板およびそれを用いた半導体モジュール
US4556899A (en) Insulated type semiconductor devices
US5490627A (en) Direct bonding of copper composites to ceramics
US4670771A (en) Rectifier module
JPH04162756A (ja) 半導体モジュール
KR910007016B1 (ko) 반도체 장치용 부품간의 접속 구조물
US5821617A (en) Surface mount package with low coefficient of thermal expansion
JPH02174144A (ja) 半導体装置用パッケージ
JPS62290158A (ja) 半導体素子塔載部のセラミツクの接合構造
US6121686A (en) Ball grid array package having through-holes disposed in the substrate under the chip
JP4013423B2 (ja) セラミックス層と金属導体層の接合体
JP2759777B2 (ja) 半導体素子搭載部のセラミックの接合構造
JP2005285885A (ja) 半導体装置
JPH07335792A (ja) 半導体素子搭載用パッケージ
JP2004343035A (ja) 放熱部品、回路基板および半導体装置
JPS63173348A (ja) 半導体装置
JP2558574B2 (ja) 半導体装置
JP2751501B2 (ja) 半導体装置及びその製造方法
JP2650044B2 (ja) 半導体装置用部品間の接続構造
JPH08222670A (ja) 半導体素子搭載用パッケージ
JP2572092Y2 (ja) 半導体素子パッケージ
JPH0741157Y2 (ja) Ｉｃパッケージ用封止キャップ
JPS6370545A (ja) 半導体パツケ−ジ
JPH06196585A (ja) 回路基板

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees