JPS62287634A - 半導体素子結線用細線 - Google Patents

半導体素子結線用細線

Info

Publication number
JPS62287634A
JPS62287634A JP61132565A JP13256586A JPS62287634A JP S62287634 A JPS62287634 A JP S62287634A JP 61132565 A JP61132565 A JP 61132565A JP 13256586 A JP13256586 A JP 13256586A JP S62287634 A JPS62287634 A JP S62287634A
Authority
JP
Japan
Prior art keywords
wire
core
copper
purity
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61132565A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0319702B2 (enExample
Inventor
Yoichi Yorita
寄田　洋一
Masaaki Shimotomai
下斗米　将昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OPTIC DAIICHI DENKO CO Ltd
Mitsubishi Electric Corp
Original Assignee
OPTIC DAIICHI DENKO CO Ltd
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OPTIC DAIICHI DENKO CO Ltd, Mitsubishi Electric Corp filed Critical OPTIC DAIICHI DENKO CO Ltd
Priority to JP61132565A priority Critical patent/JPS62287634A/ja
Publication of JPS62287634A publication Critical patent/JPS62287634A/ja
Publication of JPH0319702B2 publication Critical patent/JPH0319702B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/015—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/432—Mechanical processes
    • H01L2224/4321—Pulling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/43—Manufacturing methods
    • H01L2224/438—Post-treatment of the connector
    • H01L2224/43848—Thermal treatments, e.g. annealing, controlled cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45147—Copper (Cu) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45599—Material
    • H01L2224/456—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45638—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/4554—Coating
    • H01L2224/45599—Material
    • H01L2224/456—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45663—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/4567—Zirconium (Zr) as principal constituent
    • H10W72/01515—
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/50—
    • H10W72/522—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/552—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/555—
    • H10W90/756—

Landscapes

  • Metal Extraction Processes (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Wire Bonding (AREA)
JP61132565A 1986-06-06 1986-06-06 半導体素子結線用細線 Granted JPS62287634A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61132565A JPS62287634A (ja) 1986-06-06 1986-06-06 半導体素子結線用細線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61132565A JPS62287634A (ja) 1986-06-06 1986-06-06 半導体素子結線用細線

Publications (2)

Publication Number Publication Date
JPS62287634A true JPS62287634A (ja) 1987-12-14
JPH0319702B2 JPH0319702B2 (enExample) 1991-03-15

Family

ID=15084274

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61132565A Granted JPS62287634A (ja) 1986-06-06 1986-06-06 半導体素子結線用細線

Country Status (1)

Country Link
JP (1) JPS62287634A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011243659A (ja) * 2010-05-14 2011-12-01 Furukawa Electric Co Ltd:The 平角銅線及びその製造方法、並びに太陽電池用平角銅線及びその製造方法
WO2012022404A3 (de) * 2010-07-22 2012-06-28 W.C. Heraeus Gmbh & Co. Kg Kern-mantel-bändchendraht
JP2015159341A (ja) * 2015-06-11 2015-09-03 日立金属株式会社 銅ボンディングワイヤ
WO2020071002A1 (ja) * 2018-10-01 2020-04-09 富山住友電工株式会社 めっき線材の製造方法およびめっき線材の製造装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011243659A (ja) * 2010-05-14 2011-12-01 Furukawa Electric Co Ltd:The 平角銅線及びその製造方法、並びに太陽電池用平角銅線及びその製造方法
WO2012022404A3 (de) * 2010-07-22 2012-06-28 W.C. Heraeus Gmbh & Co. Kg Kern-mantel-bändchendraht
US9236166B2 (en) 2010-07-22 2016-01-12 Heraeus Deutschland GmbH & Co. KG Core-jacket bonding wire
EP3425665A1 (de) * 2010-07-22 2019-01-09 Heraeus Deutschland GmbH & Co KG Verfahren zur herstellung eines bonddrahtes
JP2015159341A (ja) * 2015-06-11 2015-09-03 日立金属株式会社 銅ボンディングワイヤ
WO2020071002A1 (ja) * 2018-10-01 2020-04-09 富山住友電工株式会社 めっき線材の製造方法およびめっき線材の製造装置

Also Published As

Publication number Publication date
JPH0319702B2 (enExample) 1991-03-15

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