JPS6228228A - フレキシブル配線板の接着硬化方法 - Google Patents
フレキシブル配線板の接着硬化方法Info
- Publication number
- JPS6228228A JPS6228228A JP60168143A JP16814385A JPS6228228A JP S6228228 A JPS6228228 A JP S6228228A JP 60168143 A JP60168143 A JP 60168143A JP 16814385 A JP16814385 A JP 16814385A JP S6228228 A JPS6228228 A JP S6228228A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- pressure
- wiring board
- vessel
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 16
- 238000001723 curing Methods 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000011800 void material Substances 0.000 abstract description 2
- 230000002349 favourable effect Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 27
- 239000010410 layer Substances 0.000 description 27
- 239000007789 gas Substances 0.000 description 21
- 238000001816 cooling Methods 0.000 description 9
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000002706 hydrostatic effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910002092 carbon dioxide Inorganic materials 0.000 description 2
- 239000001569 carbon dioxide Substances 0.000 description 2
- 239000000112 cooling gas Substances 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Laminated Bodies (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60168143A JPS6228228A (ja) | 1985-07-30 | 1985-07-30 | フレキシブル配線板の接着硬化方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60168143A JPS6228228A (ja) | 1985-07-30 | 1985-07-30 | フレキシブル配線板の接着硬化方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6228228A true JPS6228228A (ja) | 1987-02-06 |
| JPH0312536B2 JPH0312536B2 (enrdf_load_stackoverflow) | 1991-02-20 |
Family
ID=15862625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60168143A Granted JPS6228228A (ja) | 1985-07-30 | 1985-07-30 | フレキシブル配線板の接着硬化方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6228228A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4974663A (en) * | 1988-06-30 | 1990-12-04 | Ashida MFG. Co., Ltd. | Cross-circulating method and apparatus for autoclave |
| KR20020042372A (ko) * | 2000-11-30 | 2002-06-05 | 이상수 | Fpc내의 기포 제거방법 |
| US20220026939A1 (en) * | 2020-07-27 | 2022-01-27 | Shao-Chi Liu | Material processing apparatus and operating method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5364286A (en) * | 1976-11-22 | 1978-06-08 | Ishikawajima Harima Heavy Ind | Method and apparatus for pressing panel structure by gas |
-
1985
- 1985-07-30 JP JP60168143A patent/JPS6228228A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5364286A (en) * | 1976-11-22 | 1978-06-08 | Ishikawajima Harima Heavy Ind | Method and apparatus for pressing panel structure by gas |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4974663A (en) * | 1988-06-30 | 1990-12-04 | Ashida MFG. Co., Ltd. | Cross-circulating method and apparatus for autoclave |
| KR20020042372A (ko) * | 2000-11-30 | 2002-06-05 | 이상수 | Fpc내의 기포 제거방법 |
| US20220026939A1 (en) * | 2020-07-27 | 2022-01-27 | Shao-Chi Liu | Material processing apparatus and operating method thereof |
| CN114005766A (zh) * | 2020-07-27 | 2022-02-01 | 刘劭祺 | 材料处理设备及其操作方法 |
| JP2022023786A (ja) * | 2020-07-27 | 2022-02-08 | 劭▲祺▼ 劉 | 材料処理装置及びその操作方法 |
| US12051600B2 (en) | 2020-07-27 | 2024-07-30 | Shao-Chi Liu | Material processing apparatus and operating method thereof |
| CN114005766B (zh) * | 2020-07-27 | 2025-02-18 | 刘劭祺 | 材料处理设备及其操作方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0312536B2 (enrdf_load_stackoverflow) | 1991-02-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5039371A (en) | Apparatus for roll-consolidation of thermoplastic composite laminates | |
| US4284457A (en) | Method for bonding a skin member to honeycomb core | |
| IS3892A (is) | Aðferð við framleiðslu á samsettri plötu sem er gerð úr kjarna með holrúmum og að minnsta kosti einu ytra lagi | |
| US5096526A (en) | Core bonding and forming of thermoplastic laminates | |
| KR940007051B1 (ko) | 자기철심 및 그 합체방법 | |
| US5944935A (en) | Preparation of adhesively bonded sandwich structures | |
| JPS6228228A (ja) | フレキシブル配線板の接着硬化方法 | |
| JP2002234126A (ja) | ポリイミドフィルム積層体 | |
| JPS6223732A (ja) | フレキシブル銅張板の接着硬化方法 | |
| KR100369699B1 (ko) | 동박 및 분리 시트의 부분적 접합 방법 | |
| JPS61277428A (ja) | 積層板の成形方法 | |
| KR100600478B1 (ko) | 금속과 복합재료로 이루어진 하이브리드 동력전달축 및 그제조방법 | |
| JP2004330474A (ja) | 複合材製品の製造方法 | |
| JPS62259819A (ja) | 繊維強化プラスチツク材の製造方法 | |
| JPS61290036A (ja) | 積層板の成形方法 | |
| JPH09174546A (ja) | プリプレグの製造方法 | |
| JP2001260241A (ja) | 積層板の製造方法 | |
| JPS62117729A (ja) | フレキシブル配線板の接着硬化方法 | |
| JPS62128734A (ja) | 積層板の成型方法 | |
| JPH0328287B2 (enrdf_load_stackoverflow) | ||
| JPH0435129Y2 (enrdf_load_stackoverflow) | ||
| JP2990825B2 (ja) | 多層プリント基板の製造方法 | |
| JP2006297892A (ja) | 接着積層体及びその製造方法 | |
| JPH04115929A (ja) | カバーレイ用フィルムの貼合せ方法 | |
| JPH0852812A (ja) | 複合材加圧成形治具及び複合材成形体の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |