JPH0328287B2 - - Google Patents

Info

Publication number
JPH0328287B2
JPH0328287B2 JP60017451A JP1745185A JPH0328287B2 JP H0328287 B2 JPH0328287 B2 JP H0328287B2 JP 60017451 A JP60017451 A JP 60017451A JP 1745185 A JP1745185 A JP 1745185A JP H0328287 B2 JPH0328287 B2 JP H0328287B2
Authority
JP
Japan
Prior art keywords
plate
laminate
vacuum bag
container
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60017451A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61173911A (ja
Inventor
Naomi Nakaji
Masanobu Hayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ashida Manufacturing Co Ltd
Original Assignee
Ashida Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ashida Manufacturing Co Ltd filed Critical Ashida Manufacturing Co Ltd
Priority to JP60017451A priority Critical patent/JPS61173911A/ja
Publication of JPS61173911A publication Critical patent/JPS61173911A/ja
Publication of JPH0328287B2 publication Critical patent/JPH0328287B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulding By Coating Moulds (AREA)
JP60017451A 1985-01-30 1985-01-30 積層板の製造方法 Granted JPS61173911A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60017451A JPS61173911A (ja) 1985-01-30 1985-01-30 積層板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60017451A JPS61173911A (ja) 1985-01-30 1985-01-30 積層板の製造方法

Publications (2)

Publication Number Publication Date
JPS61173911A JPS61173911A (ja) 1986-08-05
JPH0328287B2 true JPH0328287B2 (enrdf_load_stackoverflow) 1991-04-18

Family

ID=11944384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60017451A Granted JPS61173911A (ja) 1985-01-30 1985-01-30 積層板の製造方法

Country Status (1)

Country Link
JP (1) JPS61173911A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1755850A4 (en) * 2004-06-09 2008-08-20 Ind Composites Engineering Pty PROCESS FOR FORMING OR PROCESSING POLYMER COMPOSITES
JP5292445B2 (ja) * 2010-11-26 2013-09-18 株式会社芦田製作所 オートクレーブ成形方法及びオートクレーブ成形装置
JP6424354B2 (ja) * 2012-12-04 2018-11-21 国立大学法人山梨大学 燃料電池用金属セパレータの作製方法

Also Published As

Publication number Publication date
JPS61173911A (ja) 1986-08-05

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