JPS62265731A - リ−ドフレ−ム - Google Patents

リ−ドフレ−ム

Info

Publication number
JPS62265731A
JPS62265731A JP61109807A JP10980786A JPS62265731A JP S62265731 A JPS62265731 A JP S62265731A JP 61109807 A JP61109807 A JP 61109807A JP 10980786 A JP10980786 A JP 10980786A JP S62265731 A JPS62265731 A JP S62265731A
Authority
JP
Japan
Prior art keywords
lead
lead frame
power supply
aging
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61109807A
Other languages
English (en)
Japanese (ja)
Other versions
JPH053740B2 (enExample
Inventor
Minoru Takagi
実 高木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP61109807A priority Critical patent/JPS62265731A/ja
Publication of JPS62265731A publication Critical patent/JPS62265731A/ja
Publication of JPH053740B2 publication Critical patent/JPH053740B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2884—Testing of integrated circuits [IC] using dedicated test connectors, test elements or test circuits on the IC under test

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP61109807A 1986-05-13 1986-05-13 リ−ドフレ−ム Granted JPS62265731A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61109807A JPS62265731A (ja) 1986-05-13 1986-05-13 リ−ドフレ−ム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61109807A JPS62265731A (ja) 1986-05-13 1986-05-13 リ−ドフレ−ム

Publications (2)

Publication Number Publication Date
JPS62265731A true JPS62265731A (ja) 1987-11-18
JPH053740B2 JPH053740B2 (enExample) 1993-01-18

Family

ID=14519702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61109807A Granted JPS62265731A (ja) 1986-05-13 1986-05-13 リ−ドフレ−ム

Country Status (1)

Country Link
JP (1) JPS62265731A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02135793A (ja) * 1988-11-16 1990-05-24 Ibiden Co Ltd 厚膜素子を有するフィルムキャリアの製造方法
US5239191A (en) * 1990-01-19 1993-08-24 Kabushiki Kaisha Toshiba Semiconductor wafer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02135793A (ja) * 1988-11-16 1990-05-24 Ibiden Co Ltd 厚膜素子を有するフィルムキャリアの製造方法
US5239191A (en) * 1990-01-19 1993-08-24 Kabushiki Kaisha Toshiba Semiconductor wafer

Also Published As

Publication number Publication date
JPH053740B2 (enExample) 1993-01-18

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