JPS62265727A - Ｉｃ部品の製造方法 - Google Patents
Ｉｃ部品の製造方法Info
- Publication number
- JPS62265727A JPS62265727A JP10993286A JP10993286A JPS62265727A JP S62265727 A JPS62265727 A JP S62265727A JP 10993286 A JP10993286 A JP 10993286A JP 10993286 A JP10993286 A JP 10993286A JP S62265727 A JPS62265727 A JP S62265727A
- Authority
- JP
- Japan
- Prior art keywords
- oxide film
- etching
- thickness
- film
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 238000005530 etching Methods 0.000 claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims description 21
- 238000012544 monitoring process Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 238000002955 isolation Methods 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Landscapes
- Drying Of Semiconductors (AREA)
- Weting (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10993286A JPS62265727A (ja) | 1986-05-14 | 1986-05-14 | Ｉｃ部品の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10993286A JPS62265727A (ja) | 1986-05-14 | 1986-05-14 | Ｉｃ部品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62265727A true JPS62265727A (ja) | 1987-11-18 |
| JPH0439226B2 JPH0439226B2 (enrdf_load_stackoverflow) | 1992-06-26 |
Family
ID=14522763
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10993286A Granted JPS62265727A (ja) | 1986-05-14 | 1986-05-14 | Ｉｃ部品の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62265727A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5622899A (en) * | 1996-04-22 | 1997-04-22 | Taiwan Semiconductor Manufacturing Company Ltd. | Method of fabricating semiconductor chips separated by scribe lines used for endpoint detection |
-
1986
- 1986-05-14 JP JP10993286A patent/JPS62265727A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5622899A (en) * | 1996-04-22 | 1997-04-22 | Taiwan Semiconductor Manufacturing Company Ltd. | Method of fabricating semiconductor chips separated by scribe lines used for endpoint detection |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0439226B2 (enrdf_load_stackoverflow) | 1992-06-26 |
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