JPS6226199B2 - - Google Patents
Info
- Publication number
- JPS6226199B2 JPS6226199B2 JP10010081A JP10010081A JPS6226199B2 JP S6226199 B2 JPS6226199 B2 JP S6226199B2 JP 10010081 A JP10010081 A JP 10010081A JP 10010081 A JP10010081 A JP 10010081A JP S6226199 B2 JPS6226199 B2 JP S6226199B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed wiring
- wiring board
- insulating base
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011888 foil Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 238000005452 bending Methods 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 description 31
- 238000007598 dipping method Methods 0.000 description 10
- 238000004080 punching Methods 0.000 description 8
- 230000004907 flux Effects 0.000 description 5
- 238000005476 soldering Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000004637 bakelite Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 230000002925 chemical effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10010081A JPS582097A (ja) | 1981-06-25 | 1981-06-25 | プリント配線板の抜脱方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10010081A JPS582097A (ja) | 1981-06-25 | 1981-06-25 | プリント配線板の抜脱方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS582097A JPS582097A (ja) | 1983-01-07 |
| JPS6226199B2 true JPS6226199B2 (enrdf_load_stackoverflow) | 1987-06-08 |
Family
ID=14264973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10010081A Granted JPS582097A (ja) | 1981-06-25 | 1981-06-25 | プリント配線板の抜脱方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS582097A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6349586A (ja) * | 1986-08-19 | 1988-03-02 | 株式会社日本製鋼所 | 固定式連結器装置 |
-
1981
- 1981-06-25 JP JP10010081A patent/JPS582097A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS582097A (ja) | 1983-01-07 |
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